“Our wafer level packaging is a very sophisticated, high value, and complex process,” said Georg Sparschuh, Production Manager at SCHOTT Advanced Packaging. “A single problem related to routing, for example, could cost the company a significant amount of money. If you have to scrap one wafer – you just lost a lot. So it is imperative that a completely automated and highly reliable MES system controls this manufacturing process.”
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GIS Weekly Magazine
Susan Smith
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Look for the next issue of GIS Weekly Magazine on May 28, 2012.
Each GISWeekly Review delivers to its readers news concerning the latest developments in the GIS industry, along with a selection of other articles that we feel you might find interesting. |
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