SAN FRANCISCO, CA, November 30th, 2011 — Helic Inc., the technology leader in EDA solutions for high-speed IC design and Elipse Engineering, a subsidiary of Elbatech Ltd. Group specializing in engineering design services for the aerospace, defence and civilian industries, announce the integration of Helic’s VeloceRF™ and VeloceRaptor/X™ into Elipse’s RFIC design flow.
With its advanced technical expertise and dedicated support, Helic aims to assist Elipse Engineering in the development of RFIC chips that enable compact, power efficient and cost effective ESA solutions for various applications.
Thanks to its unique component-synthesis engine, VeloceRF™ generates DRC and DFM-correct inductive devices according to the designer specifications. VeloceRF™ brings a complete solution for achieving an optimal floorplan, enabling silicon area reduction by optimizing inductor sizes. The tool de-risks the design from electromagnetic effects, incorporating EM coupling parasitics in post-layout simulation. In addition, VeloceRaptor/X™ is a breakthrough RLCK modeling tool with unparalleled capacity and speed suitable for integrated passives such as transmission lines, interconnects, digital high-speed lines, spiral inductive devices and MIM/MOM capacitors.
According to Zohar Kaufman, Elipse CTO: “Elipse Engineering, bound by its commitment to design under the highest quality standards, sees in Helic a reliable partner who can meet its requirements for optimum yield, speed, seamless integration and accuracy.”
“The agreement with Elipse is definitely a milestone for Helic. Elipse’s very demanding design applications tested our technology to the extreme. Armed with this great customer success, we’ll intensify our efforts to expand to the Israeli market, one of the most important semiconductor communities worldwide”, said Nikolas Provatas, Vice President of Sales and Business Development at Helic.
Helic, Inc. develops disruptive EDA technologies for RFIC and high-speed SoC design. We provide our customers with a comprehensive offering combining design tools, silicon IP and applications support, greatly reducing the development cycles of chips for wireless communications, broadband networking, PCs, tablets and other segments. We provide technology for rapid electromagnetics modeling, RF component synthesis, and signal integrity of silicon ICs and Systems-in-Package. Our solutions have been adopted by several major semiconductor companies since 2000. Helic is headquartered at 101 Montgomery Street, suite 2650, San Francisco, CA 94104.
For additional information please contact:
Nikolas Provatas, T: +1 866 994 3542