Bolsens will open the "3-D Integration – Shaping the Future" keynote session on Tuesday morning, following opening remarks by conference co-chairs Matt Nowak, Senior Director of Advanced Technology for Qualcomm and Phil Garrou, IEEE Fellow and Consultant for Microelectronic Consultants of NC. Bolsens will be joined by executives from Mentor Graphics, TSMC and IBM in a speaker line-up that will delve into the 3-D IC opportunities and challenges facing the semiconductor industry from the perspective of fabless, EDA, foundry and integrated device manufacturer (IDM) companies.
Tuesday, December 13, 2011
2.5-D ICs: Just a Stepping Stone or a Long Term Alternative to 3-D?
Ivo Bolsens Keynote
8:00 a.m. - 8:30 a.m.
Hyatt Regency San Francisco Airport Hotel – Burlingame, California
In a session titled " 2.5-D ICs: Just a Stepping Stone or a Long Term Alternative to 3-D?" Bolsens will look at the progression of 3-D technology, technical challenges for 3-D vs. 2.5-D, visit a case study for 2.5-D FPGAs, and discuss future directions in 3-D IC design.
About the 3-D Architectures for Semiconductor Integration & Packaging Conference
The 3-D Architectures for Semiconductor Integration and Packaging Conference is part of RTI (Research Triangle Institute) International's Technology Venture Forum Series, which seeks to provide insight on the impact of significant emerging technologies. For more information on the conference, please visit: http://techventure.rti.org/index.html.
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