MoSys Demonstrates Interoperability of its Bandwidth Engine® IC at DesignCon 2012

SANTA CLARA, Calif. — (BUSINESS WIRE) — January 30, 2012 — MoSys, Inc. (NASDAQ: MOSY):



MoSys (NASDAQ: MOSY), a provider of serial chip-to-chip communications solutions that deliver unparalleled bandwidth performance for next generation networking systems and advanced system-on-chip (SoC) designs, is exhibiting at DesignCon 2012 in booth 615. MoSys will demonstrate interoperability between its Bandwidth Engine® IC and the newest 28nm FPGAs from both Altera Corporation and Xilinx, Inc.



DesignCon is renowned as being the premier event for the semiconductor and electronic design engineering community. DesignCon 2012 is no exception. It is the largest meeting of board designers and is the only event to address chip design engineers’ chip/system/package challenges. It is the place for this community to network, identify solutions to immediate design challenges, and meet in person the solution providers for your next project. DesignCon brings together engineers, suppliers, analysts and media from across the globe, including Asia and the Pacific Rim. DesignCon’s exhibit floor offers the semiconductor and electronic design engineering communities a place to showcase their latest technological advancements and product developments.



DesignCon 2012 begins January 30, 2012 and concludes February 2, 2012. The exhibition takes place on January 31 and February 1, 2012.


Santa Clara Convention Center
5001 Great America Parkway
Santa Clara, CA 95054

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