Xilinx Reaches Industry Milestone with Record-Fast 28nm Product Rollout: $1B in Design Wins, Thousands of Device Shipments in First Year of Introduction

Company fuels highest bandwidth systems with Virtex-7 FPGAs, meets aggressive cost/power requirements with Kintex-7 FPGAs, achieves unrivaled performance/flexibility with Zynq-7000 EPP

SAN JOSE, Calif., Feb. 14, 2012 — (PRNewswire) — Xilinx, Inc. (NASDAQ: XLNX) today announced it has reached an industry milestone with over $1B in design wins for its newest line of 28nm field programmable gate array (FPGA) and extensible processing platform (EPP) devices.  

To date, the company has shipped thousands of Virtex®-7, Virtex-7 2000T 2.5D stacked silicon interconnect (SSI), Kintex-7 and Zynq-7000 devices worldwide to more than 90 discrete customers for nearly 350 design wins. With Xilinx 28nm devices, engineering teams can easily migrate designs between product families and build scalable systems that span the entire product portfolio for a diverse set of applications, including: high-performance defense radar and video processing systems, leading-edge 200G wired communication bridges and LTE wireless communication equipment, ultra-high resolution medical imaging, advanced tools for life science research, life-saving automotive driver assistance systems, and high-precision factory automation equipment, to name a few.

"L-3 WESCAM is using the new 28nm product line from Xilinx to reduce electronics size and power consumption as we implement our next generation of advanced video processing algorithms for our surveillance and targeting products," said Steve Tritchew, chief technology officer at L-3 WESCAM.  "The Zynq Extensible Processing Platform adds a high performance industry standard dual core ARM A9 processor subsystem that will further increase our electronics integration, while reducing complexity and power consumption.  We expect Xilinx's next-generation software tool to help accelerate our product development by significantly reducing compile execution times, and providing open, industry standard support for IP libraries that should significantly improve the effectiveness of our IP re-use."

A combination of Xilinx's 28nm architecture and broad portfolio of market-tuned devices manufactured using TSMC's 28nm HPL (high-performance/low power) process has enabled the company to execute the PLD industry's fastest rollout.  Xilinx has shipped four out of five product families in just 11 months – less than half the time it took to roll out initial devices in just two product families in the previous generation. The company is also shipping three new 7 series Targeted Design Platforms for accelerating systems development and integration.  These are the first among nearly 40 to be delivered by Xilinx and/or ecosystem members supporting embedded and high-speed connectivity applications, as well as markets such as automotive, broadcast, consumer, industrial and communications.

"History has shown that the first PLD vendor to deliver products at a new process node secures a significant advantage for the lifetime of those products," said Jordan Selburn, principal analyst at market research firm IHS iSuppli, El Segundo, Calif. "The 28nm node looks to be a particularly important step for PLDs, allowing these devices to take over a meaningful amount of system functions on a device that combines both hardware and software programmability, and delivering above-market growth for the industry.  Xilinx appears to be gaining momentum with a broad portfolio of 28nm products that meet the needs of a growing base of customers."

Xilinx has taped out more than 10 devices and expects to be sampling all members of its 28nm portfolio by mid-2012.  The Kintex-7 K325T device recently passed rigorous qualification criteria and is on track for broad-based customer shipments in production volumes in the June quarter. TSMC's fully qualified HPL process has given Xilinx a tremendous time-to-market advantage and is providing yields in line with the company's aggressive roadmap and better than previous generations. 

"TSMC is pleased to be collaborating with Xilinx on the successful rollout of its 28nm devices," said Sajiv Dalal, Vice President, TSMC North America. "We see growing customer demands in TSMC's 28nm HPL process technology. TSMC's 28nm HPL process is delivering ultra low-leakage, high-performance features needed by advanced technology customers, ranging from high performance systems to mobile consumer applications."

In addition to providing customers with access to 28nm technology in record time, Xilinx is fueling the highest bandwidth systems with Virtex-7 FPGAs and meeting aggressive cost and power requirements with Kintex-7 FPGAs for wide range of applications in the fastest growing segment of the FPGA market. The remaining 7 series family, Artix™-7, is designed to address high-volume, cost-sensitive markets.  With the Zynq-7000 EPP, Xilinx is meeting demand for unrivaled levels of system performance, flexibility and integration in a new class of system-on-chip that combines an industry-standard ARM® dual-core processing system with 28nm programmable logic architecture.  For some applications, a single Zynq-7000 EPP device can replace a processor, DSP and FPGA.

To learn more about 7 series and Zynq-7000 EPP, see www.xilinx.com/7 and http://www.xilinx.com/zynq.

About Xilinx

Xilinx is the worldwide leader in complete programmable logic solutions. For more information, visit http://www.xilinx.com/.

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Xilinx, the Xilinx logo, Artix, ISE, Kintex, Spartan, Virtex, Zynq, and other designated brands included herein are trademarks of Xilinx in the United States and other countries. ARM is a trademark of ARM in the EU and other countries. All other trademarks are the property of their respective owners.

Editorial Contact:

Xilinx, Inc.

Lisa Washington

408-626-6272

lisa.washington@xilinx.com

 

 

 

SOURCE Xilinx, Inc.

Contact:
Xilinx, Inc.
Web: http://www.xilinx.com




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