X-FAB Completes Noble Metal MEMS Facility with in-House Gold Processing; Ships Billionth MEMS Device

Pure-play foundry X-FAB to exhibit at Sensors Expo

ERFURT, Germany — (BUSINESS WIRE) — June 4, 2012X-FAB Silicon Foundries today announced two major MEMS milestones: completion of its dedicated noble metal facility for MEMS and post-CMOS processing – and shipment of its billionth MEMS device. X-FAB will discuss these new MEMS achievements at the upcoming Sensors Expo on June 6 and 7, 2012, in Booth #826, at the Donald E. Stephens Convention Center in Rosemont, Ill.

The new facility, built specifically for the processing of MEMS, extends X-FAB’s existing MEMS capabilities in Erfurt, Germany, and initially adds gold deposition and patterning capability. It can handle approximately 100,000 wafers a year and will process MEMS devices for the rapidly expanding consumer, mobile and computer markets. Work began on the noble metal facility at the end of 2011 and was completed this month on schedule. The full equipment set is installed and being qualified for production.

Iain Rutherford, Business Line Manager for X-FAB’s MEMS foundry service, commented, “With today’s announcement of the new noble metal facility, we further demonstrate our commitment to MEMS manufacturing and, along with our earlier addition of 8-inch MEMS capability, we add even more value to the wafer manufacturing process. Since 1995, we have manufactured and shipped a billion MEMS devices, including gyroscopes, accelerometers, pressure sensors, thermopiles and microfluidic devices, as well as CMOS integrated MEMS sensors and wafer-level packaged devices for consumer, automotive and medical applications. The addition of the new MEMS facility reflects our passion to fully support our customers with MEMS, sensors and analog/mixed-signal technology foundry services.”

About X-FAB

X-FAB is the leading analog/mixed-signal foundry group manufacturing silicon wafers for analog-digital integrated circuits (mixed-signal ICs). X-FAB maintains wafer production facilities in Erfurt and Dresden (Germany); Lubbock, Texas (U.S.); and Kuching, Sarawak (Malaysia); and employs approximately 2,400 people worldwide. Wafers are manufactured based on advanced modular CMOS and BiCMOS processes with technologies ranging from 1.0 to 0.13 micrometers, for applications primarily in the automotive, communications, consumer and industrial sectors. For more information, please visit www.xfab.com.



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Thomas Hartung, +49-361-427-6160
VP Marketing
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www.xfab.com
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ThinkBold Corporate Communications
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