STMicroelectronics Demonstrates DOCSIS(R) 3.0-Based High-Speed Cable Modem SoC for Full-HD Multimedia and Internet-TV Services at IBC 2012

GENEVA -- (Marketwire) -- Sep 07, 2012 -- STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications and a top player in ICs for digital TVs and set-top boxes, will demonstrate a cable modem meeting the latest DOCSIS® 3.0 specifications at IBC 2012, Amsterdam, September 7 to 11.

ST's DOCSIS 3.0 modem is able to bond sixteen downlink channels and four uplink channels to achieve data speeds of 800Mbps downstream and 108Mbps upstream. This is significantly faster than modems in the market today and these data speeds will allow multiple users to experience high-quality full-HD multimedia and interactive Internet services simultaneously through the home network. ST's expertise in this technology insures high wireline data rates.

ST's DOCSIS 3.0-based cable modem technology is associated with a dual-core ARM® Cortex™-A9 processor and has applications in routing, switching, telephony, security and media-server functions. With additional multimedia support and security algorithms for pay-TV and Internet-based services, it will be at the heart of a range of ST ICs for applications such as cable set-top boxes, headed/headless gateways, and cable modems.

"DOCSIS 3.0 specification defines the functionality and performance that cable operators need to innovate and enhance services going forwards," said Laurent Remont, ST's Digital Convergence Group Vice President and Unified Platform Division General Manager. "Our DOCSIS 3.0-based technology outperforms all others currently available, and will empower ST customers to create advanced products capable of delivering high-quality content and new services such as home automation, home security and e-Health."

DOCSIS 3.0 Technology

The Data Over Cable Service Interface Specifications (DOCSIS) cable modem is used by cable service providers and equipment suppliers in major territories worldwide. Widespread adoption of DOCSIS, including EuroDOCSIS throughout Europe, has enabled cable TV operators to become full-service video, voice, and data telecommunications providers.

The latest version, DOCSIS 3.0, supports Internet Protocol TV (IPTV) allowing services such as on-demand content and streaming video, and also supports the next-generation Internet Protocol (IPv6) and delivers improvements such as enhanced quality of service.

Moreover, DOCSIS 3.0 introduces channel bonding for cable modems, a flexible technique enabling high-performance devices that provide data speeds significantly over 100Mbps. This is a key enabler for delivering rich multimedia services and fast Internet access to multiple home users, simultaneously.

Shipments of DOCSIS 3.0 customer premises equipment are predicted to reach 49 million units by 2015, according to market analyst IMS.

About STMicroelectronics
ST is a global leader in the semiconductor market serving customers across the spectrum of sense and power technologies and multimedia convergence applications. From energy management and savings to trust and data security, from healthcare and wellness to smart consumer devices, in the home, car and office, at work and at play, ST is found everywhere microelectronics make a positive and innovative contribution to people's life. By getting more from technology to get more from life, ST stands for life.augmented.

In 2011, the Company's net revenues were $9.73 billion. Further information on ST can be found at www.st.com.

ST DOCSIS 3.0 Modem at IBC 2012: http://hugin.info/152740/R/1639541/527663.pdf

For Press Information Contact:
STMicroelectronics
Michael Markowitz
Director Technical Media Relations
+1 781 591 0354

Email Contact 





Review Article Be the first to review this article
Trimble

Harris

Featured Video
Jobs
Mechanical Engineer for The Planate Management Group LLC at Perry Point, MD
Structural Engineer for Albert Kahn and Associates at Detroit, MI
Structural Engineer for The Planate Management Group LLC at Perry Point, MD
ENVIRONMENTAL GRAPHIC DESIGNER for Blitz at San Francisco, CA
Senior Mechanical Engineer for Albert Kahn and Associates at Detroit, MI
Upcoming Events
AfricaGIS 2017 Conference at ECA, 5h Floor, Room 5S17S Addis Ababa Ethiopia - Nov 20 - 24, 2017
2nd Conference GISRAfrica 2017 at Abuja Abuja Nigeria - Nov 23 - 24, 2017
2017 Conference on Big Data from Space (BiDS'17) at Centre de Congrès Pierre Baudis Toulouse France - Nov 28 - 30, 2017
GeoDATA 2017 London Showcase at ILEC Conference Centre 4 Lillie Road London United Kingdom - Nov 30, 2017
Teledyne Optech
University of Denver GIS Masters Degree Online
Teledyne:
CADalog.com - Countless CAD add-ons, plug-ins and more.



Internet Business Systems © 2017 Internet Business Systems, Inc.
25 North 14th Steet, Suite 710, San Jose, CA 95112
+1 (408) 882-6554 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering EDACafe - Electronic Design Automation TechJobsCafe - Technical Jobs and Resumes  MCADCafe - Mechanical Design and Engineering ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy PolicyAdvertise