Legacy ElectronicS First to Receive CMTL Approval as Memory supplier for Intel NUC Mini-PC platforms

SIOUX FALLS, SD -- December 18, 2012 -- Design engineers and system integrators  working with Intel’s Desktop Boards Next Unit of Computing (NUC) family, previewed in June of this year, should know that Legacy Electronics is the first memory supplier to be INTEL Advanced Tested through CMTL for this platform.  Using an Intel Core i3 processor on a 4-by-4-inch motherboard, the NUC is surprisingly small in size and an ideal engine for digital signage, kiosks, home theater systems, and intelligent devices for small spaces.

Jason Engle, Legacy Electronics’ chief executive officer, said “The Intel NUC has two SO-DIMM memory slots that support up to 8GB of Legacy 1600MHZ DDR3 memory each, for a total of 16GB of memory in an ultra-small package.  This new Intel platform is key for growth in the industry and we’re delighted to be the first CMTL-approved memory supplier for the NUC.” 

Engle added that the NUC is mSATA-capable (mini-SATA technology designed for portability), and Legacy Electronics offers a wide range of mSATA solid-state drives ranging from 8GB up to 256GB to meet the most robust storage requirements.

John Deters, CMTL’s President, commented “Legacy Electronics continues to maintain total commitment and technological superiority in the Intel platform customer base by being in the first group of memory manufacturers to be Intel Advanced Tested on the Intel NUC mini-pc product line.”  Deters continued, “The Intel mini NUC platform design represents one of the most relevant new platform form factor designs to be introduced in the industry since the notebook computer.” 

About Legacy Electronics

Founded in 1993, Legacy Electronics is a U.S.-based, ISO 9001:2008-certified contract manufacturer, designer and tester of high-speed, high-density memory modules, printed circuit boards, and other computer products.  Legacy Electronics holds several patents and trademarks, including those for its Canopy chip-stacking process technology, and its Multiple Device Canopy (MDC) for embedded computing and high-density VLP (very low profile) modules.


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