Media Alert: AWR Sponsors and Exhibits at EDICON 2013; Presents a Wide Array of Technical Papers and Workshops

EL SEGUNDO, Calif. – Feb. 26, 2013

What:

AWR is a gold sponsor at the Electronic Design Innovations Conference ( EDICON) 2013, which runs from March 12 -14 in Beijing, China. Together with parent company National Instruments, AWR will be showcasing at Booth #255 joint hardware/software solutions, as well as the first update in 2013 of the AWR Design Environment™, inclusive of Microwave Office®/Analog Office® circuit design software, Visual System Simulator™ (VSS) system design software, as well as AXIEM® 3D planar electromagnetic (EM) software and Analyst™ 3D finite element method (FEM) EM software.

In addition to software demonstrations within booth #255, AWR will present a number of papers and workshops that include:

  • Design of a Novel Multi-Slot Antenna
  • MMIC Design Workshop: Design Methodology for GaAs MMIC 1 Watt X-band PA
  • RF Power Amplifier IIB: Device Characterization Methods for Advanced RF/Microwave Design
  • Fully Integrating 3D Electromagnetic (EM) Simulation into Circuit Simulation
  • Digital Pre-Distortion Techniques Workshop:
    • Optimizing the Design and Verification of 4G RF Power Amplifiers
    • Simulating an NXP Doherty Power Amplifier with Digital Pre-Distortion

For more information about AWR’s activities at EDICON 2013 and the detailed schedule of AWR conference papers and workshops, please visit http://www.awrcorp.com/news/events/event/edi-con-2013.

Where: 
Booth #255, Beijing International Convention Center, Beijing, China

When:  
March 12-14, 2013

###

© 2013 AWR Corporation. All rights reserved. AWR, Microwave Office, Analog Office, and AXIEM are registered trademarks and the AWR logo, Visual System Simulator, Analyst, and the AWR Design Environment are trademarks of AWR Corporation. Other product and company names listed are trademarks or trade names of their respective companies.

Contact: 

    Sherry Hess
    AWR Corporation
    Vice President of Marketing
    (310) 726-3000
     Email Contact

 

 

 




Review Article Be the first to review this article
Trimble

Air bus

Featured Video
Jobs
Mechanical Engineer II - Requisition ID 090445 for L3 Technologies at New York, NY
Estimator / Bidder for Rulon International at Saint Augustine, FL
ECAD Designer - Data Connectivity for Delphi at Auburn Hills, MI
Upcoming Events
LiDAR for DRONE 2017, Jun 29-30, 2017, Montpellier, France at Montpellier France - Jun 29 - 30, 2017
International Cartographic Conference 2017 at MARRIOTT WARDMAN PARK HOTEL 2660 Woodley Road NW, Washington District Of Columbia 20008 Washington - Jul 2 - 7, 2017
GI_Forum 2017 at University of Salzburg, Interfaculty Department of Geoinformatics - Z_GIS Hellbrunnerstr. 34 Salzburg Austria - Jul 4 - 7, 2017
2017 Esri Education GIS Conf, July 8 - 11, 2017, Marriott Marquis & Marina, at Marriott Marquis & Marina San Diego CA - Jul 8 - 11, 2017
Teledyne Optech
University of Denver GIS Masters Degree Online
Teledyne:
ESRI 2017
CADalog.com - Countless CAD add-ons, plug-ins and more.



Internet Business Systems © 2017 Internet Business Systems, Inc.
595 Millich Dr., Suite 216, Campbell, CA 95008
+1 (408)-337-6870 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering EDACafe - Electronic Design Automation TechJobsCafe - Technical Jobs and Resumes  MCADCafe - Mechanical Design and Engineering ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy Policy