Spansion and UMC Announce Joint Technology Development and Licensing Agreement

Companies will develop integrated logic and Flash memory to enable creation of high-performance and low power electronics

SUNNYVALE, Calif. and HSINCHU, Taiwan, March 4, 2013 — (PRNewswire) — Spansion Inc. (NYSE: CODE), a leading innovator of Flash memory solutions, and United Microelectronics Corporation ("UMC"), today announced the joint development of a 40nm process that integrates UMC's 40nm LP logic process with Spansion® proprietary embedded Charge Trap (eCT)TM Flash memory technology. As part of this non-exclusive agreement, UMC is licensed to manufacture products based on this technology for Spansion.

Spansion embedded Charge Trap is a new high performance, low power, and cost- effective NOR Flash technology optimized for integration with advanced logic process in system-on-chip (SoC) products.  The technology is scalable beyond 40nm and can be integrated into High-k manufacturing process.  Products based on Spansion eCT will drive the development of faster, more intelligent connected technologies in industrial, automotive and consumer applications. Spansion eCT technology is a key enabler for expanding the roadmap for Spansion's Programmable System Solutions (PSS), which combine Flash memory with configurable logic to enhance processing performance for applications that are memory, processing and MIPS intensive. 

"Collaborating with UMC furthers Spansion's licensing strategy," said John Kispert, president and CEO of Spansion. "By working with a leading foundry such as UMC, we can more effectively expand our PSS product roadmap and licensing business. In addition, we will enable others to take advantage of our Charge Trap technology, extending into new markets and bringing additional value to our customers."

W.Y. Chen, COO of UMC, said, "We look forward to working with Spansion to offer an industry leading logic platform that integrates our robust 40nm production process with their well established Charge Trap memory technology. The result of the collaboration will deliver a cost-effective, innovative technology solution for customers designing into a wide range of market segments."

 Resources:

About Spansion
Spansion (NYSE: CODE) is a leading provider of the Flash memory technology at the heart of the world's electronics systems, powering everything from the routers that run the internet to the highly interactive and immersive consumer and automotive electronics that are enriching people's daily lives. Spansion's broad and differentiated Flash memory product portfolio, award-winning MirrorBit charge-trapping technology, and industry leading service and support are enabling customers to achieve greater efficiency and success in their target markets. For more information, visit http://www.spansion.com.

Spansion(R), the Spansion logo, MirrorBit(R), and combinations thereof, are trademarks and registered trademarks of Spansion LLC in the United States and other countries. Other names used are for informational purposes only and may be trademarks of their respective owners.

SOURCE Spansion Inc.

Contact:
Spansion Inc.
United Microelectronics Corporation
Spansion Press, Linda Goncalves
Phone: +1-408-616-3701 (office)
Phone: +1-408-642-0286 (cell)
Email Contact
Investor Relations, Rahul Mathur
Phone: +1-408-616-6682
Email Contact
UMC Press Contact, Richard Yu
Phone: +886 2-2658-9168 ext. 16951
Email Contact
Web: http://www.spansion.com




Review Article Be the first to review this article

Photosat

Featured Video
Jobs
GIS Analyst for G2 Partners LLC at San Ramon, CA
GIS Software Developer for UDC at Englewood, CO
GIS Software Developer for SoCalGas at Los Angeles, CA
Architectural Designer for Champion Home Builders at Troy, MI
Vice President, Transportation Services for Associated General Contractors of New York State at Albany, NY
Upcoming Events
GEO WEEK 2017 at Washington DC - Oct 23 - 27, 2017
GIS-PRO 2017 at Jacksonville FL - Oct 23 - 26, 2017
Commercial UAV EXPO Americas at The Westgate Resort Las Vegas NV - Oct 24 - 26, 2017
6th International Colloquium on Scientific and Fundamental Aspects of GNSS / Galileo at Technical University of Valencia Valencia Spain - Oct 25 - 27, 2017
Teledyne Optech
CADalog.com - Countless CAD add-ons, plug-ins and more.



Internet Business Systems © 2017 Internet Business Systems, Inc.
25 North 14th Steet, Suite 710, San Jose, CA 95112
+1 (408) 882-6554 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering EDACafe - Electronic Design Automation TechJobsCafe - Technical Jobs and Resumes  MCADCafe - Mechanical Design and Engineering ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy PolicyAdvertise