Presentation to Include Flash, Antifuse and SRAM Technology ComparisonALISO VIEJO, Calif., April 5, 2013 — (PRNewswire) — Microsemi Corporation (Nasdaq: MSCC), a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, today announced it will host a single event upset (SEU) webinar titled "SEU Immunity: Is Your Design Really Safe?" on Wednesday, April 17 at 8 a.m. PDT. The webinar is intended for design engineers focused on safety-critical aviation, defense, industrial and medical applications.
Topics will include:
- SEU Overview – What they are and why they matter
- Comparison of Flash, Antifuse and SRAM FPGAs and the risks of malfunction due to SEUs
- Results of SEU tests on Flash, Antifuse, and SRAM FPGAs
Webinar attendees will receive information on the risks and consequences of configuration failures in Flash, Antifuse and SRAM FPGA technologies, as well as background information on the physical failure mechanisms associated with SEUs. To register for the webinar, please visit https://www1.gotomeeting.com/register/830266089.
About Single Event Upsets (SEUs)
SEUs are caused when sub-atomic particles such as neutrons strike the silicon substrate of an integrated circuit and cause binary code bits to flip, which can corrupt configuration cells in SRAM FPGAs and may cause catastrophic hardware malfunctions. Free neutrons are present at all levels in the atmosphere, at higher concentrations at higher altitudes, and are especially problematic at aviation altitudes. Sources of sub-atomic particles also exist in IC packaging materials. Microsemi's Antifuse and Flash-based FPGAs do not experience changes of configuration due to subatomic particles. This is in direct contrast to SRAM FPGAs, which can experience catastrophic changes of functionality due to SEUs affecting their configuration.
Microsemi's Configuration-safe Devices
Microsemi is a leading supplier of programmable logic solutions used extensively in aviation, defense, industrial and other safety critical applications due to their high reliability and immunity to configuration changes due to SEU occurrences.
SmartFusion™2 SoC FPGAs:
- Meet industry standards including IEC 61508, DO254 and DO178B;
- Configuration SEU immunity of zero failures in time (FIT); and
- Only SoC FPGA that protects all its SoC embedded SRAM memories from SEU errors.
ProASIC®3 and ProASIC®-Plus FPGAs:
- Large and growing heritage of successful deployment in DAL-A and DAL-B safety critical aviation applications on Boeing and Airbus aircraft; and
- Wide variety of device densities and package sizes.
- SEU-hardened flip-flops use built-in triple modular redundancy (TMR); and
- QML Class V qualification and screening.
Microsemi Corporation (Nasdaq: MSCC) offers a comprehensive portfolio of semiconductor and system solutions for communications, defense & security, aerospace and industrial markets. Products include high-performance, radiation-hardened and highly reliable analog mixed-signal integrated circuits, FPGAs, SoCs and ASICs; power management products; timing and voice processing devices; RF solutions; discrete components; security technologies and scalable anti-tamper products; Power-over-Ethernet ICs and midspans; as well as custom design capabilities and services. Microsemi is headquartered in Aliso Viejo, Calif., and has approximately 3,000 employees globally. Learn more at www.microsemi.com.
Microsemi and the Microsemi logo are registered trademarks or service marks of Microsemi Corporation and/or its affiliates. Third-party trademarks and service marks mentioned herein are the property of their respective owners.
"Safe Harbor" Statement under the Private Securities Litigation Reform Act of 1995: Any statements set forth in this news release that are not entirely historical and factual in nature, including without limitation statements related to its SEU webinar and configuration-safe devices, and its potential effects on future business, are forward-looking statements. These forward-looking statements are based on our current expectations and are inherently subject to risks and uncertainties that could cause actual results to differ materially from those expressed in the forward-looking statements. The potential risks and uncertainties include, but are not limited to, such factors as rapidly changing technology and product obsolescence, potential cost increases, variations in customer order preferences, weakness or competitive pricing environment of the marketplace, uncertain demand for and acceptance of the company's products, adverse circumstances in any of our end markets, results of in-process or planned development or marketing and promotional campaigns, difficulties foreseeing future demand, potential non-realization of expected orders or non-realization of backlog, product returns, product liability, and other potential unexpected business and economic conditions or adverse changes in current or expected industry conditions, difficulties and costs of protecting patents and other proprietary rights, inventory obsolescence and difficulties regarding customer qualification of products. In addition to these factors and any other factors mentioned elsewhere in this news release, the reader should refer as well to the factors, uncertainties or risks identified in the company's most recent Form 10-K and all subsequent Form 10-Q reports filed by Microsemi with the SEC. Additional risk factors may be identified from time to time in Microsemi's future filings. The forward-looking statements included in this release speak only as of the date hereof, and Microsemi does not undertake any obligation to update these forward-looking statements to reflect subsequent events or circumstances.
SOURCE Microsemi Corporation
Gwen Carlson, Director of Corporate Communications, 949.380.6135 or Beth P. Quezada, Communications Specialist, 949.380.6102