Open-Silicon Extends its TSMC VCA Partnership to Include Israel

MILPITAS, Calif., April 5, 2013 -- Open-Silicon, Inc., a leading semiconductor design and manufacturing company, today announced that it has extended its TSMC Value Chain Aggregator (VCA) program membership to include Israel. Open-Silicon has been a TSMC partner in North America since its founding in 2003.

Open-Silicon has had a presence in Israel for almost ten years and is highly committed to its goal of providing best-in-class ASIC design services in the region. Through its collaborative relationship with TSMC, Open-Silicon can build on its existing relationships in Israel and continue to provide front-end design services such as ASIC architecture, RTL design and design verification, as well as physical design and complete manufacturing services. 

"We're proud that TSMC has selected Open-Silicon as a VCA member in Israel," said Dr. Naveed Sherwani, president and CEO of Open-Silicon. "Through our collaborative relationship with TSMC we can more easily meet our goal of delivering customer-centric solutions, operational excellence and high customer satisfaction."

"Building on Open-Silicon's track record in Israel, TSMC is pleased to welcome Open-Silicon to the VCA program in Israel where Open-Silicon leverages its value-added services, local presence and design expertise to best serve emerging and system companies. We look forward to extending the VCA service reach with Open-Silicon for Israeli customers," said Maria Marced, President of TSMC Europe BV.

TSMC's VCA program was developed to integrate design enablement building blocks within TSMC's Open Innovation Platform™ (OIP) and provide specific services at each link in the IC value chain, including IP development, design backend, wafer manufacturing, assembly and testing.

About Open-Silicon, Inc.

Open-Silicon, a leading supplier and developer of customer-specific products (CSPs), provides ASICs, platforms, concept-to-parts development, customized IP, low-effort derivative design, and state-of-the-art manufacturing solutions.  With Open-Silicon, customer's benefit from global engineering including an ARM® Technology Center of Excellence, advanced SerDes integration, 2.5D interposer-based package engineering, experienced architects, leading-edge physical design methodology, and embedded software development, all leveraging the industry's best technology from both Open-Silicon and the open market. For more information, visit Open-Silicon's website at  www.open-silicon.com or call 408-240-5700. 




Review Article Be the first to review this article
Harris

Trimble Catalyst

Featured Video
Jobs
Geospatial Analyst for Vencore at Suitland, MD
Intelligence and Image Analyst for Boeing at Las Cruces, NM
Geospatial Intelligence Analyst for Quick Services LLC at Fort Bragg, NC
Mgr Mechanical Engineering 2 for Northrop Grumman at Melbourne, FL
Sr. Mechanical Engineer for Kateeva at Newark, CA
MECHANICAL ENGINEER for Peter R. Thom and Associates at ORINDA, CA
Upcoming Events
DGI 2017 at QEII Centre London United Kingdom - Jan 23 - 25, 2017
GMP Compliance for Quality Control Laboratories 2016 at Andheri Kurla Road, Sahar Village, Andheri-Kurla Road, Mumbai, Maharashtra 40005 Mumbai, Maharashtra India - Jan 23 - 24, 2017
Geospatial World Forum 2017 Hyderabad at Hyderabad International Convention Center P.O Bag 1101, Cyberabad Post Office Hyderabad Telangana India - Jan 23 - 25, 2017
Teledyne Optech
Teledyne:
CADalog.com - Countless CAD add-ons, plug-ins and more.



Internet Business Systems © 2017 Internet Business Systems, Inc.
595 Millich Dr., Suite 216, Campbell, CA 95008
+1 (408)-337-6870 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering EDACafe - Electronic Design Automation TechJobsCafe - Technical Jobs and Resumes  MCADCafe - Mechanical Design and Engineering ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy Policy