Bruker Corporation Launches ContourSP 3D Optical Microscope for PCB Industry

Large-Format Metrology System Debuts to Over $5 Million in Orders

BILLERICA, Mass. — (BUSINESS WIRE) — December 10, 2013 — Bruker Corporation (NASDAQ: BRKR) today announced that it has launched the ContourSP large panel metrology system, which more than doubles the measurement throughput of the high-density interconnect (HDI) substrates in multi-chip modules (MCM) over previous generation SP models used by the semiconductor packaging industry. Specifically designed to measure each layer of the printed circuit board (PCB) panels during manufacturing, the gage-capable ContourSP assures the minimum recipe development time, highest yield, maximum up-time, and lowest cost per measured panel in production. These features have already led to over $5 million in orders by several leading HDI/MCM PCB manufacturers.

Bruker's ContourSP 3D Optical Microscope for the Printed Circuit Board Industry (Photo: Business Wir ...

Bruker's ContourSP 3D Optical Microscope for the Printed Circuit Board Industry (Photo: Business Wire)

“Demand for Bruker’s fifth generation SP model continues to build as early adoption customers enjoy the advanced capabilities and ease of use offered by the ContourSP,” said Mark R. Munch, Ph.D., President of the Bruker MAT Group. “By doubling the throughput and adding new proprietary measurement capabilities, our customers are able to achieve maximum productivity in this era of ever smaller line widths and tighter tolerances in the PCB industry.”

“Not only is the ContourSP much faster than other systems at performing these precise measurements, but we have added a number of productivity enhancing features,” added Kent Heath, Senior Director of Marketing for Bruker’s Stylus and Optical Business. “The new Vision64® operator interface with multi-processing features multi-region analysis, automatic re-measurement, and our proprietary Dynamic Signal Segmentation (DSS) analysis, making the ContourSP the most comprehensive tool available.”

About ContourSP
Based on white light interferometry, the ContourSP incorporates decades of packaging and panel measurement experience to provide unprecedented speed, metrology capability, reliability, serviceability, and manufacturing readiness for 3D critical dimension measurements in MCM and HDI PCB applications. Bruker’s high-performance 3D optical microscopes feature Vision64 operating and analysis software, and the industry's most intuitive, modular user interface to deliver user-level-customization capabilities for the widest possible range of surface profiling metrology applications. The ContourSP also utilizes Bruker’s revolutionary gantry-based design and integrated workstation to support up to 600x600-millimeter samples in a highly compact footprint.

About Bruker Corporation (NASDAQ: BRKR)
Bruker is a leading provider of high-performance scientific instruments and solutions for molecular and materials research, as well as for diagnostics, industrial and applied analysis. For more information, please visit www.bruker.com.



Contact:

Media Contact:
Bruker Nano Surfaces Division
Stephen Hopkins, +1-520-741-1044 x1022
Marketing Communications
Email Contact
or
Investor Contact:
Bruker Corporation
Joshua Young, +1-978-667-9580, ext. 1479
Vice President, Investor Relations
Email Contact




Review Article Be the first to review this article

Harris

Featured Video
Jobs
Business Development Leader for Geomni, Inc at Spartanburg, South Carolina
Senior Account Manager, Utilities for RAMTeCH Software Solutions, Inc. at Stillwater, Minnesota
GIS ANALYST for Cobb County Government at Marietta, California
Vice President, GIS Business Unit for RAMTeCH Software Solutions, Inc. at Stillwater, Minnesota
GIS Analyst for Institute for Children and Poverty at New York, California
LiDar Specialist for Geomni, Inc at Frederick, Maryland
Upcoming Events
Geospatial, Hydrometeorological and GNSS Conference at Prague Czech Republic - Oct 17 - 19, 2018
Eye On Earth Symposium 2018 at Mina A’Salam Hotel Dubai United Arab Emirates - Oct 22 - 24, 2018
SGEM Florence 2018, Palazzo Borghese at Palazzo Borghese, Via Ghibellina 110, 50122 Florence, Italy Florence Florence Italy - Oct 23 - 26, 2018
Esri Malaysia User Conference 2018 at Kuala Lumpur Convention Centre Kuala Lumpur Malaysia - Oct 25, 2018
Teledyne Optech
Teledyne:



Internet Business Systems © 2018 Internet Business Systems, Inc.
25 North 14th Steet, Suite 710, San Jose, CA 95112
+1 (408) 882-6554 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering EDACafe - Electronic Design Automation TechJobsCafe - Technical Jobs and Resumes  MCADCafe - Mechanical Design and Engineering ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy PolicyAdvertise