Rambus Engineers and Scientists to Present New Research and Training at DesignCon 2014

SANTA CLARA, Calif. — (BUSINESS WIRE) — January 28, 2014 — Rambus Inc. (NASDAQ: RMBS):

Who:

    Rambus Inc. (NASDAQ: RMBS)
 

Where:

DesignCon
Santa Clara Convention Center – Booth #301
5001 Great America Parkway, Santa Clara, Calif.

DesignCon.com

 

When:

January 28 - 31, 2014

 

At DesignCon 2014, Rambus engineers and scientists will present two papers on the latest research in ultra-high speed interface design and deliver training on the latest low-power, high-performance memory solutions.

Additionally, Rambus will be demonstrating various IP cores, tools and emerging architectures designed to deliver robust and easy to integrate solutions in its booth (#301), including: the LabStation™ validation platform, R+™ LPDDR3, and R+ technologies for extending main memory beyond DDR4.

Click to Tweet: @rambusinc will be exhibiting, speaking and demonstrating at  @UBMDesignCon 2014 on 1/28-31#Innovation

Paper Presentations:

Title: “An Implementer’s Guide to Low-Power and High-Performance Memory Solutions”
Rambus Speakers/Authors: Scott Best, Wendem Beyene, Ming Li
Date: Tuesday, January 28, 2014
Time: 9:00 a.m.-12:00 p.m.

This session provides an in-depth analysis of standard DRAM memory solutions for low-power and high-performance applications. Specifically, the session will cover the interactions between signaling, clocking and packaging technology of a memory interface, and how this knowledge can be used to analyze and compare different popular memory interfaces for different applications including mobile, compute, graphics, and server.


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