"Using programmability to implement 4G and multi-standard baseband modem functionality can accelerate time-to-market," said Alex Sum, vice president of sales and marketing at GCT Semiconductor. "We are pleased to be working with Cadence to further advance our LTE chipsets. Using the Tensilica ConnX BBE16 DSP core allows chip makers to develop a product that meets the cost and power requirements. It also facilitates a tight integration of existing hardware blocks and the flexibility to tune the modem via software."
The Tensilica ConnX BBE16 DSP core is a very efficient 16-MAC (multiply-accumulate) DSP core that has been optimized for OFDM-based wireless communication modem. It is fully programmable in C, eliminating the need for assembly coding found in other DSPs and also enables easier software development and maintenance.
For more information about the Tensilica ConnX BBE16 DSP, visit http://ip.cadence.com/ipportfolio/tensilica-ip/comms-dsp.
Cadence enables global electronic design innovation and plays an essential role in the creation of today's integrated circuits and electronics. Customers use Cadence software, hardware, IP, and services to design and verify advanced semiconductors, consumer electronics, networking and telecommunications equipment, and computer systems. The company is headquartered in San Jose, Calif., with sales offices, design centers, and research facilities around the world to serve the global electronics industry. More information about the company, its products, and services is available at www.cadence.com.
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