Vicor Delivers 48 V Direct-to-Processor Power Conversion With Intel VR12.5 Compliant Solution for High-Efficiency Datacenters

ANDOVER, MA -- (Marketwired) -- Apr 29, 2014 -- Vicor Corporation (NASDAQ: VICR) today announced that its Intel VR12.5-compliant, 48 V direct-to-processor power conversion solution is now shipping in volume to OEMs. Designed for use in high performance x86 servers, Vicor is enabling space and power chain efficiencies with an innovative approach that departs from conventional multiphase power conversion. Compliant with Intel's VR12.5 voltage regulation specification, Vicor's advanced single stage, 'two chip' solution for processor power is enabling advanced power schemes in efficiency-focused datacenters.

Vicor's VR12.5-compliant solution is comprised of the Picor Cool-Power® PI3751 ZVS buck-boost regulator and the VI Chip® 1323 VTM® current multiplier. This chip set deploys a Factorized Power Architecture® (FPA®) scheme that separates regulation and voltage transformation between the components. Dedicating regulation and transformation separately within two highly integrated power processing modules enables superior performance across valuable metrics such as motherboard area, routing and signal conditioning, efficiency and cooling.

With 36-60 V input voltage range capability, Vicor's solution simplifies and streamlines the power delivery chain significantly. Battery backup can be interfaced directly, enabling higher system availability. Three-phase rectifiers can also be used, leveraging the efficiency of DC distribution and economies of scale offered by telecom markets. In Haswell-based x86 systems, Vicor's solution meets dynamic requirements without having to deploy complex control schemes like dynamic phase management, while eliminating the need for bulk capacitance. Vicor's two chip power path also enables easier routing to the processor and minimizes distribution losses from the input source to the socket. Just 10x14x2.5mm and 13x23x4.5mm in size, these high-density, thermally adept components draw on Vicor's power component packaging technology utilizing System in Package (SiP) and Converter housed in Package (ChiP) platforms.

"Progressive techniques are being used to advance power efficiencies while increasing compute capacity within datacenters," said Phil Davies, Corporate Vice President, Global Sales and Marketing, Vicor. "Vicor is enabling these goals by providing a high density power component design methodology and reducing the number of conversion steps to go from 380 VDC to the point of load. By utilizing our recently launched 1.75 kW 380 V to 48 V ChiP BCMs with this new VR12.5 solution, datacenter power engineers can leverage all the advantages of a 48 V hub, including reduced distribution losses, direct battery backup and efficient conversion from renewable DC energy sources."

For More Information
Visit Vicor's website for more information about Vicor's solutions for powering datacenters.

Follow Vicor on Social Media
Twitter: @VicorPower
Vicor Corporation on LinkedIn
Vicor PowerBlog

About Vicor Corporation
Headquartered in Andover, Massachusetts, Vicor Corporation designs, manufactures and markets innovative, high-performance modular power components, from bricks to semiconductor-centric solutions, to enable customers to efficiently convert and manage power from the wall plug to the point of load. Complementing an extensive portfolio of patented innovations in power conversion and power distribution with significant application development expertise, Vicor offers comprehensive product lines addressing a broad range of power conversion and management requirements across all power distribution architectures, including CPA, DPA, IBA, FPA™ and CBA. Vicor focuses on solutions for performance-critical applications in the following markets: enterprise and high performance computing, telecommunications and network infrastructure, industrial equipment and automation, vehicles and transportation and aerospace and defense electronics.

Vicor, Picor, Cool-Power, VI Chip, VTM and FPA are trademarks of Vicor Corporation.

Image Available:


Colin Boroski
Rainier Communications
508-475-0025 x 142

Email Contact 

Review Article Be the first to review this article

Featured Video
GIS Specialist for Fresno Irrigation District at Fresno, CA
Geospatial Analyst - Senior for BAE Systems Intelligence & Security at Springfield, VA
Senior Mechanical Engineer for BAE Systems Intelligence & Security at Arlington, VA
Geospatial Systems Administrator for BAE Systems Intelligence & Security at arnold, MO
Avionics System Engineer for BAE Systems Intelligence & Security at Arlington, VA
Division Engineer for Montana Dept. Of Commerce at Helena, MT
Upcoming Events
Webinar: What's New in Global Mapper v19.1 at United States - Feb 27, 2018
2018 Esri Developer Summit at Palm Springs Convention Center Palm Springs CA - Mar 6 - 9, 2018
Gi4DM 2018: GeoInformation for Disaster Management at Suleyman Demirel Cultural Center Maslak Campus of Istanbul Technical University (ITU) Istanbul Turkey - Mar 18 - 21, 2018
2018 GIS/CAMA Technologies Conference at Hyatt Regency Houston Houston TX - Mar 19 - 22, 2018
Teledyne Optech

Internet Business Systems © 2018 Internet Business Systems, Inc.
25 North 14th Steet, Suite 710, San Jose, CA 95112
+1 (408) 882-6554 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering EDACafe - Electronic Design Automation TechJobsCafe - Technical Jobs and Resumes  MCADCafe - Mechanical Design and Engineering ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy PolicyAdvertise