Cadence Announces New Integrated Solution for Rapid Die-Package Interconnect Planning

Enables concurrent optimization of multi-fabric elements, leading to lower cost and higher performance

SAN JOSE, Calif., May 21, 2014 — (PRNewswire) —  Cadence Design Systems, Inc., a leader in global electronic design innovation, today announced a new integrated solution to significantly cut down die-package interconnect planning time from weeks to days by reducing iterations between silicon and package design teams. The solution, built on Cadence® OrbitIO™ technology, also shortens the time to converge on the physical interface between the die and package up to 60 percent, all within the context of the full system.

Cadence Logo.

Building on its leadership position for co-design in the implementation stage, Cadence OrbitIO technology is used earlier in the design cycle to provide rapid interconnect planning of high-performance interfaces across multiple fabrics. As part of an overall co-design solution, Cadence OrbitIO technology provides seamless integration with Cadence SiP Layout and the Cadence Encounter® digital implementation platform. This integrated solution allows design teams to clearly communicate design intent throughout the flow, resulting in better decision-making, fewer iterations and shorter cycle-times. It can enable fabless semiconductor or systems companies to evaluate package route feasibility, and allows them to communicate a route plan to their package design resources, whether it is to an internal group or to an outsourced assembly and test (OSAT) provider.

"The Cadence OrbitIO global view of system connectivity helps Faraday reduce the time required to converge on the optimal die bump to package ball pad assignment," said Dr. Wang-Jin Chen, senior technologist of Faraday. "The combination of connectivity optimization and route feasibility functions helped us produce a route plan resulting in two fewer package layers with all DDR signals implemented on a single package layer."

To learn more about OrbitIO technology, please visit:

About Cadence

Cadence  (NASDAQ: CDNS) enables global electronic design innovation and plays an essential role in the creation of today's integrated circuits and electronics. Customers use Cadence software, hardware, IP, and services to design and verify advanced semiconductors, consumer electronics, networking and telecommunications equipment, and computer systems. The company is headquartered in San Jose, Calif., with sales offices, design centers, and research facilities around the world to serve the global electronics industry. More information about the company, its products, and services is available here.

© 2014 Cadence Design Systems, Inc. All rights reserved worldwide. Cadence, the Cadence logo, and Encounter are registered trademarks of, and OrbitIO is a trademark of, Cadence Design Systems, Inc. in the United States and other countries.

For more information, please contact:
Cadence Newsroom
Email Contact

Logo -


SOURCE Cadence Design Systems, Inc.

Cadence Design Systems, Inc.

Review Article Be the first to review this article

Featured Video
Currently No Featured Jobs
Upcoming Events
Commercial UAV Expo 2016 at MGM Grand Hotel Conference Center Las Vegas NV - Oct 31 - 2, 2016
GIS-Pro 2016: URISA's 54th Annual Conference at Toronto Canada - Oct 31 - 3, 2016
24th ACM SIGSPATIAL International Conference at San Francisco Bay Area, California, USA San Francisco - Oct 31 - 3, 2016
Teledyne Optech
Teledyne: - Countless CAD add-ons, plug-ins and more.

Internet Business Systems © 2016 Internet Business Systems, Inc.
595 Millich Dr., Suite 216, Campbell, CA 95008
+1 (408)-337-6870 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering EDACafe - Electronic Design Automation TechJobsCafe - Technical Jobs and Resumes  MCADCafe - Mechanical Design and Engineering ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy Policy