Xilinx JESD204B IP shortens development time and enables high speed AD/DA serial interface to accelerate data transfer
TOKYO, June 24, 2014 / PRNewswire/ -- Xilinx, Inc. (NASDAQ: XLNX) announced today that their Virtex®-7 FPGA is to be deployed in NEC Corporation's iPASOLINK millimeter wave communications systems. NEC's iPASOLINK series is an ultra-compact system for building wireless backhaul networks in overseas markets.
The high-performance, high-density Virtex-7 FPGA contributed to iPASOLINK's enhanced performance and size reduction. NEC also leveraged the JESD204 LogiCORE™ IP to facilitate connections with high-speed AD/DA converters, improving data transfer rates and shortening development time of the overall system.
"NEC provides network systems and services to global customers—mainly telecoms—with assets in both IT and networks," commented Atsushi Noro, deputy general manager of NEC's Mobile Wireless Solutions Division. "The Virtex-7 device allowed us to shorten development time while improving iPASOLINK's mobile backhaul data transfer rate."
"We're delighted to be a part of NEC's iPASOLINK millimeter wave communications systems and contributing to building high-reliability network systems," said Sunil Kar, vice president of Wireless Communications at Xilinx. "The Virtex-7 FPGA delivers extraordinary levels of capacity and performance for high-speed networks, which has contributed to our leadership in the networking space."
NEC's iPASOLINK is small, lightweight, and easy to install, allowing for considerable flexibility of location. Designed to be installed outdoors, the units are waterproof and dustproof and can withstand temperatures ranging from −33 degrees C in winter and 50 degrees C in summer. These attributes contribute to their reliability and make them suitable for use in environmental conditions anywhere in the world.
For more information on the Virtex-7 family of FPGAs, visit www.xilinx.com/products/silicon-devices/fpga/virtex-7/index.htm.
Xilinx is the world's leading provider of All Programmable FPGAs, SoCs, and 3D ICs. These industry-leading devices are coupled with a next-generation design environment and IP to serve a broad range of customer needs, from programmable logic to programmable systems integration. For more information, visit www.xilinx.com.
Silvia E. Gianelli