Spansion and XMC Expand Partnership to Jointly Develop 3D NAND

SUNNYVALE, Calif. and WUHAN, China, Feb. 5, 2015 — (PRNewswire) — Spansion Inc. (NYSE: CODE), a global leader in embedded systems solutions, and XMC, China's fastest growing 300mm semiconductor foundry, today announced that the two companies will work together to develop and manufacture 3D NAND technology. The companies have signed development and cross-licensing agreements.

Spansion logo.

According to TechNavio, 3D NAND is expected to grow at a compounded annual growth rate of over 180% by 2018.  The increase in memory requirements and demand for low form factors for NAND flash is contributing to this growth.

"The explosion of data created by the rapid growth of the Internet of Things and more advanced automotive systems is placing greater demands on storage technologies. 3D NAND will revolutionize how data will be more efficiently stored in the future," said Ali Pourkeramati, senior vice president of strategic alliances at Spansion.  "Our leading charge trap MirrorBit® technology, which we invented over 10 years ago, will be the key advantage for 3D NAND innovation and will provide unparalleled high-performance data storage."

"We are pleased to co-develop 3D NAND technology with Spansion," said Michael Chen, Chief Business Officer of XMC. "XMC will continue to leverage its leading edge manufacturing capabilities, extensive volume production experience with charge trap technology and world-class R&D team in memory expertise. By partnering with Spansion, we are confident to successfully bring innovative 3D NAND technology to market. "

The first 3D NAND products will be available in 2017.

Resources:

About Spansion
Spansion (NYSE: CODE) is a global leader in embedded systems solutions. Spansion's flash memory, microcontrollers, analog and mixed-signal products drive the development of faster, intelligent, secure and energy efficient electronics. Spansion is at the heart of electronics systems, connecting, controlling, storing and powering everything from automotive electronics and industrial systems to the highly interactive and immersive consumer devices that are enriching people's daily lives. For more information, visit http:// www.spansion.com

About XMC

XMC is an emerging leader in semiconductor manufacturing, with a unique partnership model and a specialized technology focus. The company offers comprehensive 300MM foundry services built on proven technology expertise and a commitment to customer service excellence. It first began production in 2008 and is headquartered in Wuhan, China. More information can be found at www.xmcwh.com

Spansion®, the Spansion logo, MirrorBit®, HyperBus, HyperFlash, HyperRAM and combinations thereof, are trademarks or registered trademarks of Spansion LLC in the United States and other countries. Other names used are for informational purposes only and may be trademarks of their respective owners.

Logo - http://photos.prnewswire.com/prnh/20060118/SFW077LOGO

To view the original version on PR Newswire, visit: http://www.prnewswire.com/news-releases/spansion-and-xmc-expand-partnership-to-jointly-develop-3d-nand-300031868.html

SOURCE Spansion Inc.

Contact:
Spansion Inc.
XMC
Spansion Press: Michele Landry, 408-616-3817
Email Contact Spansion Investor Relations: Rahul Mathur, 408-616-6682
Email Contact XMC Press: Karen Fan
Phone: +86 18986179880
Email Contact
Web: http://www.spansion.com




Review Article Be the first to review this article

Harris

Featured Video
Jobs
Geospatial Analyst/Programmer for LANDIQ at Sacramento, California
Product Manager for CHA Consulting, Inc. at Boston, Massachusetts
Software Developer for CHA Consulting, Inc. at Norwell, Massachusetts
GIS Data Analyst for CostQuest Associates, Inc. at Cincinnati, Ohio
Mid-Level Mechanical Engineer for Kiewit at lenexa, Kansas
System Designer/Engineer for Bluewater at Southfield, Michigan
Upcoming Events
GEO Business 2018 at 52 Upper Street London United Kingdom - May 22 - 23, 2018
Upper Midwest Geospatial Conference (UMGEOCON) at 521 East Ave North La Crosse WI - May 23 - 24, 2018
Locate 2018 at Pier 27, The Embarcadero San Francisco CA - May 30 - 31, 2018
2nd WY UAV Symposium at UW Convention Center 2229 Grand Ave LARAMIE WY - May 30 - 31, 2018
Teledyne Optech
Teledyne:



Internet Business Systems © 2018 Internet Business Systems, Inc.
25 North 14th Steet, Suite 710, San Jose, CA 95112
+1 (408) 882-6554 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering EDACafe - Electronic Design Automation TechJobsCafe - Technical Jobs and Resumes  MCADCafe - Mechanical Design and Engineering ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy PolicyAdvertise