Toshiba Launches Low-Voltage MOSFET Series with Dual-sided Cooling Packages

Efficient heat dissipation realizes high-current operations in compact packages

TOKYO — (BUSINESS WIRE) — February 27, 2015Toshiba Corporation’s (TOKYO:6502) Semiconductor & Storage Products Company today announced the launch of a new surface–mount package series in its line-up of low-voltage MOSFET products that use dual-sided cooling to improve heat dissipation. The shipment of the 4 new products in the “DSOP Advance package” series starts from today.

Toshiba: Low-Voltage MOSFETs with Dual-sided Cooling "DSOP Advance" Packages (Photo: Business Wire)

Toshiba: Low-Voltage MOSFETs with Dual-sided Cooling "DSOP Advance" Packages (Photo: Business Wire)

The new devices have a heat sink on both sides of the package to improve heat dissipation, making it possible to realize high-current operations in compact packages.

The new MOSFETs share the same 5mm x 6mm footprint as Toshiba’s current SOP Advance package, facilitating replacement without any need to modify existing PCB layouts.

Applications:
Switching power supplies for servers and mobile devices, etc.

 

Line-up:

Part No.   VDSS
(V)
 

VGSS
(V)

  RDS(ON) (mΩ)  

Ciss
(Typ.)
(pF)

 

Crss
(Typ.)
(pF)

 

Coss
(Typ.)
(pF)

  rg
(Typ.)
(Ω)
  Qg (10V)
(Typ.)
(nC)

VGS = 10V

 

VGS = 4.5V

Typ.   MAX Typ.   MAX
TPWR8503NL 30 ±20 0.72 0.85 1.0 1.3 5300 130 2700 1.2 74
TPWR8004PL 40 ±20 0.65 0.8 0.95 1.35 7370 58 1930 0.6 103
TPW4R008NH 80 ±20 3.3 4.0 - - 4100 32 890 1.2 59
TPW4R50ANH   100   ±20   3.7   4.5   -   -   4000   31   700   1.0   58
 

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