Toshiba Launches New-Generation Transistor Arrays

Expanding line-up of the highly efficient transistor arrays by adopting DMOS FET[1] for the output driver

TOKYO — (BUSINESS WIRE) — March 31, 2015Toshiba Corporation's (TOKYO:6502) Semiconductor & Storage Products Company today announced the launch of a new generation of highly efficient transistor arrays, “TBD62xxxA series”, with a DMOS FET type output driver. The new series is the successor to the company’s “TD62xxx series” of bipolar transistor arrays, which have found wide use in applications including motors, relays and LED drives. The new generation series consists of 24 products and the start of mass production across the complete line-up is scheduled for June to September 2015.

Toshiba: new-generation transistor array "TBD62003AFWG" (Photo: Business Wire)

Toshiba: new-generation transistor array "TBD62003AFWG" (Photo: Business Wire)

Toshiba has adopted DMOS FET type output driver for the new products, as a means to secure the high efficiency required to meet customer needs for reduced power loss—DMOS FET do not require a base current, and can accept high current density per device area, keeping on-resistance low.

Toshiba has also applied the latest BiCD[2] technology. The company has positioned this as the future mainstream for analog ICs fabricated on the company’s standard 8-inch manufacturing line, the wafer size widely used in the industry for mass production

Main features of new products

1. High efficiency drive
“TBD62003A series” transistor arrays cut power loss by about 40%[3] compared with the “TD62003A series”.

2. High-voltage, large-current drive
The absolute maximum rating of the output block is 50V/0.5A.

3. Offers multiple products compliant with VIN(ON) standard according to the appropriate input stage of the circuits.

Product name  


  Appropriated input stage
TBD62502A series 14V(MIN) 14 to 25V PMOS
TBD62003A series
TBD62503A series
TBD62004A series   7.0V(MIN)   6 to 15V PMOS, 5V CMOS

4. Packages to suit various needs.
Available packages are DIP, SOP/SOL for surface mounting, and small SSOP (0.65mm pitch) for space saving.

The products can be applied in amusement equipment (pachinko and slot machines), home appliances (air conditioners and refrigerators), and industrial equipment (vending machines, banking terminals such as ATMs, office automation equipment, and FA equipment)


Comparison with in-line product

    In-line product
TD62xxxA series
  New-generation product
TBD62xxxA series
Output block device Bipolar transistor DMOS FET

Wafer manufacturing

Bipolar process  

BiCD [3] process of 130 nm
Future standard technology


A new line-up of SOL, a standard package worldwide, and small
SSOP package are planned, in addition to the line-up equivalent
with in-line products.

Pin assignment Same
Function Same



・Absolute maximum ratings of output current and voltage are the

・Input current of the new-generation products is lower, because
base current is unnecessary.

・Output voltage of the new-generation products necessary for the
drive of the output current is lower than TD62xxxA series, because
of the suppression of the on-resistance.


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