Toshiba Debuts Compact Package MOSFETs for Controlling Power Sources, Data Signals in Mobile Devices

IRVINE, Calif., Oct. 8, 2015 — (PRNewswire) —   Toshiba America Electronic Components, Inc. (TAEC)*, a committed leader that collaborates with technology companies to create breakthrough designs, today announced the launch of two new compact MOSFETs - the SSM3K35CTC and SSM3J35CTC. Housed in a newly developed compact package (CST3C) the SSM3K35CTC and SSM3J35CTC are suitable for controlling power sources or data signals in mobile devices such as smart phones and wearables.

Housed in a newly developed compact package (CST3C), Toshiba's two new compact MOSFETs are suitable for controlling power sources or data signals in mobile devices.

When it comes to the overall footprint, Toshiba's CST3C package exceeds industry standards. In fact, the CST3C package is just one-third the size of the industry standard SOT-723 package. This makes Toshiba's new MOSFETs suitable for high density mounting, and gives them the ability to achieve lower on-resistance when compared with products with a standard SOT-723 package.

Main Specifications: SSM3K35CTC, SSM3J35CTC (@Ta=25 degrees C)

Polarity

Part number

Package (Size)

Absolute maximum ratings

RDS (ON) typ. (Ω)

VDSS
(V)

ID
(A)

@|VGS|
=1.2 V

@|VGS|
=1.5 V

@|VGS|
=1.8 V

@|VGS|
=2.5 V

@|VGS|
=4.5 V

N-ch

SSM3K35MFV

SOT-723
(1.2×1.2 mm)

20

0.18

5

3

-

2

1.5 (@4V)

SSM3K35CT

SOT-883
(1.0×0.6 mm)

SSM3K35CTC*1

CST3C
(0.8×0.6 mm)

20

0.25

2.4

1.7

1.5

1.1

0.75

P-ch

SSM3J35MFV

SOT-723
(1.2×1.2 mm)

-20

-0.1

11

8.2

-

5.6

4.3 (@4V)

SSM3J35CT

SOT-883
(1.0×0.6 mm)

SSM3J35CTC*1

CST3C
(0.8×0.6 mm)

-20

-0.25

3.2

2.3

2.0

1.5

1.1

*1: New product

Features of the SSM3K35CTC and SSM3J35CTC include:

  • New compact package CST3C (0.8×0.6 mm)
  • Controllable with a gate voltage of 1.2 V
  • Low drain-source on-resistance:
    SSM3K35CTC: RDS(ON)=2.4 Ω (typ.) �nbsp;VGS=1.2 V
    SSM3J35CTC: RDS(ON)=3.2 Ω (typ.) �nbsp;VGS= -1.2 V

Pricing and Availability
Toshiba's new compact MOSFETs are available now. Please contact your local Toshiba Sales Office for samples.

*About Toshiba Corp. and TAEC

About TAEC

Through proven commitment, lasting relationships and advanced, reliable electronic components, Toshiba enables its customers to create market-leading designs. Toshiba is the heartbeat within product breakthroughs from OEMs, ODMs, CMs, VARs, distributors and fabless chip companies worldwide.  A committed electronic components leader, Toshiba designs and manufactures high-quality flash memory-based storage solutions, solid state drives (SSDs), hard disk drives (HDDs), solid state hybrid drives (SSHDs), discrete devices, custom SoCs/ASICs, imaging products, microcontrollers, wireless components, mobile peripheral devices, advanced materials and medical tubes that make possible today's leading smartphones, tablets, cameras, medical devices, automotive electronics, industrial applications, enterprise solutions and more.

Toshiba America Electronic Components, Inc. is an independent operating company owned by Toshiba America, Inc., a subsidiary of Toshiba Corporation, Japan's largest semiconductor manufacturer and the world's sixth largest semiconductor manufacturer (Gartner, 2014 Worldwide Semiconductor Revenue Estimates, December 2014 ). Founded in Tokyo in 1875, Toshiba is at the heart of a global network of over 590 consolidated companies employing over 200,000 people worldwide. Visit Toshiba's web site at www.toshiba.co.jp/index.htm .  



1 | 2  Next Page »



Review Article Be the first to review this article
HP

Harris

Featured Video
Jobs
Sr. GIS Technical Analyst for Southern California Edison SCE Transmission and Distribution Organization at Rosemead, CA
Data Scientist for University of Utah at Salt Lake City, UT
Imagery Analyst for ARA at Albuquerque, NM -1229, NM
Database Specialist for MDA Information Systems LLC at Gaithersburg, MD
Inside Sales for SolidCAM at Newtown, PA
Director of Mechanical Engineering for Velodyne LIDAR at Morgan Hill, CA
Upcoming Events
2017 GIS/CAMA Technologies Conference at Chattanooga Convention Center Chattanooga Tennessee - Mar 6 - 9, 2017
IGTF 2017 ASPRS Annual Meeting 2017 at Marriot Waterfront Baltimore Baltimore MD - Mar 11 - 17, 2017
MAPPS Federal Programs Conference at Sheraton Hall Silver Spring Maryland - Mar 13 - 15, 2017
WorldCover 2017 Conference at ESRIN Italy - Mar 14 - 16, 2017
GENEQ
Teledyne Optech
University of Denver GIS Masters Degree Online
Teledyne:
xponential2017
CADalog.com - Countless CAD add-ons, plug-ins and more.



Internet Business Systems © 2017 Internet Business Systems, Inc.
595 Millich Dr., Suite 216, Campbell, CA 95008
+1 (408)-337-6870 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering EDACafe - Electronic Design Automation TechJobsCafe - Technical Jobs and Resumes  MCADCafe - Mechanical Design and Engineering ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy Policy