Dongbu HiTek Launches Industry's First 0.18-micron BCDMOS Process

SEOUL, South Korea—(BUSINESS WIRE)—June 3, 2008— Dongbu HiTek today launched the industrys first BCDMOS (Bipolar/CMOS/DMOS) process at the 0.18-micron node, thereby setting the stage for fabless companies to reduce the size of typical 0.35-micron BCDMOS solutions by up to 40 to 60 percent, and in many cases eliminate the need for multiple chips. Initial disclosures of the companys new BCDMOS process were made last month at the International Symposium on Power Semiconductors and ICs in Orlando, Florida.

This new process supports a wide range of high-voltages from 12V to 60V as it enables a diversity of highly compact chip solutions that provide power management, LED drivers, hard disk motor control and automotive electronics as well as audio amplifiers for mobile handsets and consumer electronics.

Development of the new process was led by Kwang-dong Yoo, an EVP at Dongbu HiTek, who stated, Just as our stable 0.35-micron BCDMOS process has effectively supported fabless companies until now, we fully expect our far more compact 0.18-micron BCDMOS process to be equally stable and bring with it competitive advantages of higher levels of integration and lower manufacturing cost. In addition to these major benefits for fabless customers, he noted that Dongbu HiTek expects to net more than 30 percent higher profitability from implementing BDCMOS chips at the 0.18-micron node instead of the 0.35-micron node.

The attractiveness of BCDMOS comes from integrating analog circuits (using Bipolar), logic circuits (using CMOS) and high-voltage circuits (using DMOS) all on the same chip. According to Mr. Yoo, The ever increasing complexity of BCDMOS chip solutions has brought with it the need for higher levels of integration that typical 0.35-micron implementations can no longer accommodate. More specifically, increasingly complex 0.35-micron BCDMOS chips now require more logic functions, which fabless companies are now forced to implement with one or more additional CMOS chips at 0.18-micron and/or 130nm nodes.

The new BCDMOS process launched today by Dongbu HiTek underscores the Korean companys strong leadership in developing special process technologies. By bringing the 0.18-micron BCDMOS process to market before the worlds two largest foundries (TSMC and UMC), Dongbu HiTek expects to sharpen its competitive edge in this specialized area.

About Dongbu HiTek

Headquartered in Seoul, Korea, Dongbu HiTek Co., Ltd. offers advanced products and services across three major business areas: Agriculture, Materials and Semiconductor. The Semiconductor Business provides specialized proprietary chips and modules as well as foundry services that add high value to display, mobile and various analog applications. The companys two world-class fabs currently process 200mm wafers at nodes ranging from 0.35 microns to 110 nanometers. This wafer processing is supported by comprehensive design support (IP and design libraries), prototype development/verification, and packaging/module development. The Semiconductor Business specializes in developing best-in-class CMOS Image Sensor (CIS) and Display Driver IC (DDI) chips as well as chips that incorporate either High Voltage or Flash memory functions. Dongbu HiTeks stock is publicly traded under 000990 on the Korea Stock Exchange. For more information, visit


Dongbu HiTek USA/ Europe
Elizabeth Estrella-Basilio, +1-408-348-7538
Email Contact
Dongbu HiTek HQ
Kevin Lee, +82.17.337.4698
Email Contact

Review Article Be the first to review this article


Featured Video
Avionics System Engineer for BAE Systems Intelligence & Security at Arlington, VA
Geospatial Analyst - Senior for BAE Systems Intelligence & Security at Springfield, VA
Geospatial Systems Administrator for BAE Systems Intelligence & Security at arnold, MO
Senior Mechanical Engineer for BAE Systems Intelligence & Security at Arlington, VA
Sr Mechanical Design Engineer for Medtronic at mounds view, MN
Senior Structural Engineer for Wiss,Janney, Estner Assoicates, Inc at houston, TX
Upcoming Events
2018 Annual Convention of Virginia Association of Surveyors at 24 S. Market St Staunton VA - Jan 18 - 20, 2018
ArcGIS: Introduction at Environmental and Natural Resource Building 14 College Farm Rd New Brunswick NJ - Feb 1 - 22, 2018
International LiDAR Mapping Forum at Hyatt Regency 650 15th Street, Denver CO - Feb 5 - 7, 2018
Automated ISR & Battle Management Summit at Mary M. Gates Learning Center Alexandria VA - Feb 13 - 14, 2018
Teledyne Optech
Teledyne: - Countless CAD add-ons, plug-ins and more.

Internet Business Systems © 2018 Internet Business Systems, Inc.
25 North 14th Steet, Suite 710, San Jose, CA 95112
+1 (408) 882-6554 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering EDACafe - Electronic Design Automation TechJobsCafe - Technical Jobs and Resumes  MCADCafe - Mechanical Design and Engineering ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy PolicyAdvertise