SEMATECH to Host 3D IC Workshop on Manufacturing and Reliability

ALBANY, N.Y. & AUSTIN, Texas—(BUSINESS WIRE)—August 18, 2008— SEMATECH will host global experts representing a broad spectrum of the semiconductor industry at a workshop designed to explore manufacturing and reliability challenges for three-dimensional integrated circuit (3D IC) products. The forum, entitled Manufacturing and Reliability Challenges for 3D ICs using TSVs, will be held in conjunction with the Advanced Metallization Conference, September 25 and 26, at the Del Mar Fairgrounds in San Diego, California.

The workshop will feature informative sessions on applications, manufacturing processes, and reliability issues of through silicon via (TSV) technology. Participants from various disciplines will have the opportunity to address and actively discuss challenges of 3D IC integration with TSV, including physical design, processing options, failure mechanisms, and practical issues that impact cost, schedule, and performance.

We are very excited to support the growth of this enabling technology by bringing together some of the industrys leading researchers and practitioners to stimulate discussion on the real-world manufacturing and reliability challenges of TSVs, said Larry Smith, committee chairman and SEMATECHs 3D reliability and product interlock expert. Our goals are to identify key challenges so that 3D IC products can be introduced on schedule with the expected cost, performance and reliability.

The workshop curriculum includes technical presentations and a poster session led by key representatives from IBM, Qualcomm, Atotech, TechSearch, SUSS MicroTech, Alchimer, AllVia, University of Texas at Austin, Rensselaer Polytechnic Institute, Fraunhofer IZM, SINTEF, NXP Semiconductors, Ebara, Tango, Air Products, STS, Applied Materials, EV Group and PVA-Tepla.

3D ICs using TSV have the potential to play a very important role in semiconductor manufacturing. TSVs can improve electrical performance, lower power consumption, enable the integration of heterogeneous devices, shrink device size, and reduce cost. SEMATECH hosts a variety of forums to accelerate the adoption of these technologies and to drive industry consensus on the different 3D options. SEMATECHs 3D program encompasses equipment evaluations, unit processes, integration and metrology.

Registration for this event is open to both SEMATECH members and the general public. For more information on the September workshop, including registration and other relevant information, please visit: http://www.sematech.org/meetings/announcements/8510/.

About SEMATECH:

For 20 years, SEMATECH® ( www.sematech.org) has set global direction, enabled flexible collaboration, and bridged strategic R&D to manufacturing. Today, we continue accelerating the next technology revolution with our nanoelectronics and emerging technology partners.



Contact:

SEMATECH
Erica McGill, 518-956-7446
Email Contact




Review Article Be the first to review this article

Photosat

Featured Video
Jobs
GIS Analyst for G2 Partners LLC at San Ramon, CA
GIS Software Developer for UDC at Englewood, CO
Vice President, Transportation Services for Associated General Contractors of New York State at Albany, NY
Senior Mechanical Engineer for Albert Kahn and Associates at Detroit, MI
Mechanical Engineer for The Planate Management Group LLC at Perry Point, MD
Upcoming Events
GIS-PRO 2017 at Jacksonville FL - Oct 23 - 26, 2017
GEO WEEK 2017 at Washington DC - Oct 23 - 27, 2017
Commercial UAV EXPO Americas at The Westgate Resort Las Vegas NV - Oct 24 - 26, 2017
6th International Colloquium on Scientific and Fundamental Aspects of GNSS / Galileo at Technical University of Valencia Valencia Spain - Oct 25 - 27, 2017
Teledyne Optech
CADalog.com - Countless CAD add-ons, plug-ins and more.



Internet Business Systems © 2017 Internet Business Systems, Inc.
25 North 14th Steet, Suite 710, San Jose, CA 95112
+1 (408) 882-6554 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering EDACafe - Electronic Design Automation TechJobsCafe - Technical Jobs and Resumes  MCADCafe - Mechanical Design and Engineering ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy PolicyAdvertise