Bookham Launches Ultra-Compact Amplifier

SAN JOSE, Calif., Sept. 10 /PRNewswire-FirstCall/ -- Bookham, Inc. (NASDAQ: BKHM) has announced the launch of an ultra-compact small form factor amplifier gainblock that measures 70 x 40 x 7.5mm, and represents a 72 percent volume reduction compared to the MSA standard amplifier gainblock. The MiNi Block(TM) u7040 is being sampled to customers and will be generally available in Q4 2008.

The MiNi Block u7040 amplifier gainblock is primarily targeted at 40Gb/s transport systems in which low-noise optical amplification is required for each channel before the 40Gb/s receiver, and space is at a premium. Due to its low height of 7.5mm, and small footprint, the ultra-compact amplifier can also support 40Gb/s transponder designers looking to integrate optical amplifiers into the standard transponder footprint. The product is enabled by the industry leading Bookham Mini-DIL un-cooled 980nm pump module.

"We see an increasing market for an amplifier of this extremely small size," said director of product management, Mark Ives. "40Gb/s networks are beginning to see major deployments and we are confident that the per-channel amplification requirement will create a real need for an ultra-compact optical amplification solution. We have been able to achieve this significant size reduction through our packaging expertise and commitment to developing small in-feed products, such as the Mini-DIL 980nm pump."

The MiNi Block u7040 amplifier gainblock offers output power of up to 15dBm and produces only 1.2W thermal dissipation. The product is built using standard components, including telecom-grade 125u fiber, features the de facto industry standard 12-way electrical connector, and is available in semi-custom variants to meet specific customer requirements.

About Bookham

Bookham, Inc. is a leading provider of high performance optical products, spanning from components to advanced subsystems. The company designs and manufactures a broad range of solutions tailored for the telecommunications optical infrastructure and selected markets, including industrial, life sciences, semiconductor, and scientific. The Company utilizes proprietary core technologies and a vertically integrated manufacturing organization to provide its customers with cost-effective and innovative devices, as well as flexible, scalable product delivery. Bookham is a global company, headquartered in San Jose, Calif., with leading edge chip fabrication facilities in the UK and Switzerland, and manufacturing sites in the US and China.

Bookham and all other Bookham, Inc. product names and slogans are trademarks or registered trademarks of Bookham, Inc. in the USA or other countries

Web site: http://www.bookham.com//




Review Article Be the first to review this article
Trimble

Harris

Featured Video
Jobs
Mechanical Engineer I for Air Techniques, Inc at Melville, NY
Proposal Support Coordinator for Keystone Aerial Surveys at Philadelphia, PA
Upcoming Events
GIS Cloud Workshop In Syracuse, New York at Syracuse NY - Aug 22, 2017
ENVI Analytics Symposium 2017 at The Brown Palace Hotel & Spa Denver Colorado - Aug 22 - 24, 2017
GeoSmart Asia 2017 at Putrajaya International Convention Centre (PICC) Putrajaya Malaysia - Aug 22 - 24, 2017
GENEQ
Teledyne Optech
University of Denver GIS Masters Degree Online
Teledyne:
GeoSmartAsia
CADalog.com - Countless CAD add-ons, plug-ins and more.



Internet Business Systems © 2017 Internet Business Systems, Inc.
25 North 14th Steet, Suite 710, San Jose, CA 95112
+1 (408) 882-6554 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering EDACafe - Electronic Design Automation TechJobsCafe - Technical Jobs and Resumes  MCADCafe - Mechanical Design and Engineering ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy Policy