Toshiba Announces Space-Saving Dual Channel IC-Couplers

Surface Mount Optocouplers in S08 Packages Reduce Board Area by 40 Percent Compared to Single-Channel Devices

IRVINE, Calif., April 8 /PRNewswire/ -- Toshiba America Electronic Components, Inc. (TAEC)*, a committed leader that collaborates with technology companies to create breakthrough designs, has expanded its IC photocoupler lineup with three dual-channel, totem-pole output devices housed in low profile S08 packages. Each of these devices, developed by Toshiba Corp. (Toshiba), reduce board area by approximately 40 percent per channel compared to single-channel devices in MFSOP6 packages to help reduce size and cost of multi-channel applications.

Two 5Mbps devices include the TLP2105, with buffer logic output, and the TLP2108, with inverter logic output. Applications for these photocouplers include insulated bus drivers, high speed line receivers, and system interfaces for microprocessors.

The 15Mbps TLP2166A features inverter logic output and a supply voltage of 3.3V, making it suitable for high speed, low-voltage applications such as interfaces for digital measurement and control equipment, insulated PC boards and various communication protocols.

Technical Specifications TLP2105

    Specification           Symbol           TLP2105               TLP2108

    Package                                 S08 5.1mm x         S08 5.1mm x
                                             3.95mm x             3.95mm x
                                              2.5mm                2.5mm

    Output type                          General purpose,     General purpose,
                                          buffer logic        inverter logic
                                          (totem-pole)        (totem-pole)

    Power supply voltage      V(CC)        4.5 to 20V            4.5 to 20V

    Input current logic       I(F)           1.6mA                  1.6mA
     high output (max.)

    Logic low output          V(OL)           0.6V                   0.6V
     voltage (max.)

    Propagation delay time   t(pHL)          250ns                  250ns
     (max.) (H to L)

    Propagation delay time   t(pLH)          250ns                  250ns
     (max.) (L to H)

    Operating temperature    T(opr)   -40 degrees C to       -40 degrees C to
     range                              +100 degrees C         +100 degrees C

    Common-mode transient    CMR          +/-10kV/us             +/-10kV/us
     immunity (min.)

    Isolation voltage        BV(S)         2500Vrms               2500Vrms
     (min.)

Technical Specifications TLP2166A

    Specification                   Symbol

    Package                                      S08 5.1mm x 3.95mm x 2.5mm

    Output type                               General purpose, inverter logic
                                                        (totem pole)

    Power supply voltage          V(CC)                  3.0 to 3.6V

    Input current logic high      I(FHL)                    3mA
     output (max.)

    Propagation delay time
     (max.) (H to L)              t(pHL)                   75ns

    Propagation delay time        t(pLH)                   75ns
     (max.)  (L to H)

    Operating temperature         T(opr)              -40 degrees C to
     range                                             +100 degrees C

    Common-mode transient         CMR                  +/-15 kV/us
     immunity (min.)

    Isolation voltage (min.)      BV(S)                  2500Vrms

Pricing and Availability

Samples of the Toshiba dual-channel photocouplers are available now. Prices for the 5Mbps TLP2105 and TLP2108 are $1.72 in quantities of 100. The TLP2166A is priced at $2.00 each in quantities of 100.

1 | 2  Next Page »



Review Article Be the first to review this article
Harris

Featured Video
Jobs
Project Manager for Keystone Aerial Surveys at Philadelphia, PA
GIS Specialist for Fresno Irrigation District at Fresno, CA
Geospatial Systems Administrator for BAE Systems Intelligence & Security at arnold, MO
Senior Mechanical Engineer for BAE Systems Intelligence & Security at Arlington, VA
GIS Analyst for City of Columbia, MO at Columbia, MO
Division Engineer for Montana Dept. Of Commerce at Helena, MT
Upcoming Events
USC Spatial Science Summit at 3540 South Figueroa Los Angeles CA - Feb 23, 2018
2018 Los Angeles Geospatial Summit at USC Radisson Hotel 3540 S Figueroa St. Los Angeles CA - Feb 23, 2018
Webinar: What's New in Global Mapper v19.1 at United States - Feb 27, 2018
2018 Esri Developer Summit at Palm Springs Convention Center Palm Springs CA - Mar 6 - 9, 2018
Teledyne Optech
University of Denver GIS Masters Degree Online
Teledyne:
CADalog.com - Countless CAD add-ons, plug-ins and more.



Internet Business Systems © 2018 Internet Business Systems, Inc.
25 North 14th Steet, Suite 710, San Jose, CA 95112
+1 (408) 882-6554 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering EDACafe - Electronic Design Automation TechJobsCafe - Technical Jobs and Resumes  MCADCafe - Mechanical Design and Engineering ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy PolicyAdvertise