STMicroelectronics Reports 2009 First Quarter Financial Results

On March 30, ST announced the completion of a $500 million medium-term committed credit-facilities program as part of its ongoing efforts to improve liquidity and enhance financial flexibility.

At the end of March, the French Ministry of Economy, Industry and Employment and ST signed the framework agreement of the "Nano2012" Research and Development program which confirmed ST as the Coordinator and Project Leader and allocated to the Company Euro 340 million (about $450 million USD) in grants for the period 2008-2012.

On February 12, 2009, an arbitration panel of the Financial Industry Regulatory Authority (FINRA) awarded ST, in its dispute with Credit Suisse Securities (USA) LLC, an amount of approximately $406 million comprising compensatory damages, as well as interest, attorney's fees, and consequential damages, against the transfer by ST to Credit Suisse Securities (USA) LLC of its entire portfolio of asset-backed securities. In addition, ST is entitled to retain the approximately $25 million interest amount which had already been paid on the portfolio. The securities, with a par value of $415 million, are at the end of the first quarter of 2009 carried on the books as non-current financial assets at a value of $184 million, as the result of various impairment charges recorded against income. ST is currently seeking enforcement of the FINRA arbitration award in the United States District Court for the Southern District of New York.

On February 3, STMicroelectronics and Ericsson announced the closing of their agreement merging Ericsson Mobile Platforms and ST-NXP Wireless into a 50/50 joint venture. The transaction was completed on the terms originally announced on August 20, 2008. The JV begins as a major supplier to four of the industry's top five handset manufacturers, who together represent about 80 percent of global handset shipments, as well as to other industry leaders. Ericsson contributed $1.1 billion net to the joint venture, out of which $0.7 billion was paid to ST. Prior to the closing of the transaction, ST exercised its option to buyout NXP's 20 percent ownership stake of ST-NXP Wireless for a price of $92 million.

Q1 2009 Products, Technology and Design Wins

Automotive, Consumer, Computer and Telecom Infrastructure (ACCI)

Product Highlights

    --  In automotive powertrain and safety applications, ST expanded its market
        share for 32-bit microcontrollers (MCUs) based on the PowerPC
        architecture with significant design wins for next-generation products,
        including: an airbag platform from a major European player for use by
        car makers in Europe and the US; an airbag platform from a tier-one
        Japanese customer targeting the mid- to low-end market in China; and an
        ABS platform from another Japanese tier-one OEM. In addition, ST is also
        to supply smart power products for these design wins.

    --  In car-body applications, ST gained an important design win from a major
        Korean OEM for a smart junction-box application for devices including
        application-specific automotive ICs, 8-bit STM8A MCUs and VIPower(TM)
        chips. ST also gained a design win for a new generation of actuator ICs
        for controlling door locks, electric windows and mirrors, from a leading
        European car maker, in addition to multiple wins for its STM8A MCU in
        various applications in many new car platforms.

    --  In car radios and multimedia, ST's next-generation digital audio and
        connectivity processor has been selected by two major European car radio
        makers for their Model Year 2012 platforms. Additionally, ST's GPS
        technology was selected by a major system maker for telematics
        applications in South America. ST also received orders for its Cartesio
        automotive application processor from a major European OEM for a
        telematics box to be used by a European car maker.

    --  In consumer applications, ST introduced two single-chip set-top-box
        (STB) ICs, the STi5197 for cable STBs and STi5189 for satellite STBs.
        The chips enable efficient development and fast time-to-market for
        products such as basic zappers, interactive and Digital Video Recorder
        (DVR) capable STBs, and hybrid STBs. ST also announced its energy-saving
        STB architecture, which has already been implemented in several of the
        company's leading-edge STB decoders.

    --  Additionally, ST also received two important product certifications: the
        STV0498 STB IC has been certified by CableLabs Europe, allowing
        deployment in interactive STBs for cable TV networks; and ST gained an
        industry first with certification for the latest revision of the
        DisplayPort Compliance standard for two products, including the recently
        announced STDP3100 DisplayPort-to-VGA converter.

    --  In consumer audio, ST began shipments of three new Sound Terminal
        products embedding ST's proprietary FFX digital amplification technology
        to world-leading makers of home audio systems and LCD TVs.

    --  In imaging, ST introduced the market's first quarter-inch
        optical-format, 3-megapixel sensors with Extended-Depth-of-Field (EDoF)
        capabilities. Enabling camera modules as small as 6.5 x 6.5mm, the
        sensors combine high-quality images with size and cost benefits,
        offering an alternative to auto-focus camera solutions.

    --  In computer peripherals, ST gained a design win for a next-generation
        motor controller IC, using the company's proprietary BCD process, from a
        leading hard-disk-drive maker for enterprise applications.

    --  In communications infrastructure applications, ST gained a design win
        for ASICs that will be used by a world-leading manufacturer in its
        enterprise-switching networking products.

Industrial and Multi-Segment (IMS) Product Highlights

    --  In 32-bit microcontrollers, ST added another new line to its
        breakthrough 32-bit STM32 ARM Cortex-M3 based MCU family. The STM32
        Connectivity Line offers high-performance variants with Ethernet, CAN
        and full-speed USB On-The-Go interfaces. ST also introduced the STM32
        Primer2 prototyping tool, which adds a rich range of features for
        embedded design.

    --  In 8-bit MCUs, ST announced the general availability of the robust and
        reliable STM8S105 and STM8S207 for industrial and consumer applications.
        Additionally, ST unveiled its open-source capacitive touch-sensing
        software library for its 8-bit STM8 MCU platform to enable easy
        implementation of touch-sensitive controls.

        --    In  MEMS  (Micro  Electro-Mechanical  Systems),  ST  announced  that  its  3-axis
                accelerometer  technology  is  providing  motion-sensing  functions  in
                Openmoko's  Neo  Freerunner  Linux-based  mobile  open  platform.  Also,  ST
                expanded  its  portfolio  of  ultra-compact  high-performance  MEMS  sensors
                with  a  3-axis  accelerometer,  with  absolute  analog  output,  which  is  ideal
                for  motion-sensing  applications  in  space-  and  cost-constrained
                battery-operated  devices.  ST  also  gained  design  wins  for  its
                motion-sensing  technology  from  a  major  US  laptop  maker  and  in  many
                consumer  and  communications  applications  from  customers  in  China  and

« Previous Page 1 | 2 | 3 | 4 | 5 | 6 | 7  Next Page »

Review Article Be the first to review this article

Featured Video
Mechanical Engineer for Allen & Shariff Corporation at Pittsburgh, Pennsylvania
Mid-Level Mechanical Engineer for Kiewit at lenexa, Kansas
Upcoming Events
International Conference on Geomatics, Geomapplica 2018 at Syros - Mykonos islands Greece - Jun 25 - 29, 2018
18 International Multidisciplinary Scientific GeoConference SGEM 2018 at Paradise Blue 5 *****, Congress Center Albena Resort & Spa Bulgaria - Jun 30 - 9, 2018
2018 Esri User Conference at San Diego Convention Center San Diego CA - Jul 9 - 13, 2018
SUE Association at Capitol Skyline Hotel 10 “I” Eye Street, SW Washington, DC - Jul 26, 2018
Teledyne Optech
Interdrone 2018

Internet Business Systems © 2018 Internet Business Systems, Inc.
25 North 14th Steet, Suite 710, San Jose, CA 95112
+1 (408) 882-6554 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering EDACafe - Electronic Design Automation TechJobsCafe - Technical Jobs and Resumes  MCADCafe - Mechanical Design and Engineering ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy PolicyAdvertise