Si2 and TechAmerica Announce Transfer of the Compact Model Council to Si2

AUSTIN, Texas & WASHINGTON — (BUSINESS WIRE) — May 31, 2013 — The Silicon Integration Initiative (Si2) and TechAmerica have announced the transfer of the Compact Model Council (CMC) to Si2. All future development, research, administrative, marketing, and accounting activities of the CMC will be carried out under the bylaws and operating procedures of Si2. The CMC will be renamed the Compact Model Coalition to blend with Si2’s organizational structure.

“TechAmerica is proud to have supported the excellent work of the Compact Modeling Council, which over the years has expanded both in terms of deliverables and value to industry,” says Shawn Osborne, President & CEO, TechAmerica. “Si2 is an ideal new home for CMC members to grow their important standardization work for the semiconductor industry as TechAmerica continues to focus on our core products of policy advocacy and creating the best networking events and intelligence for our members.”

“We are pleased with the level of collaboration enjoyed with TechAmerica, where we achieved a successful outcome that benefits all parties”, says Steve Schulz, President and CEO, Si2. “We anticipate strong engineering leverage between CMC and Si2’s other semiconductor industry standards. This will further enhance the value proposition for the CMC and for all Si2 members.”

The CMC, formed in 1996, develops and standardizes compact models of electronic devices used within commercial circuit simulators across the electronics industry, including virtually all SPICE-class simulation. The CMC, represented by 37 member companies, supports 20 active subcommittees and has produced over a dozen widely-used standard device models, modeling API, and SPICE language standard.

Details of the transfer and future plans will be presented at the Design Automation Conference (DAC) to be held in Austin, TX from June 2-6. The first presentation will be at the Si2 25th Anniversary Luncheon Celebration on June 3, 12-1:30 PM in Room 9ABC in the Austin Convention Center. The luncheon is free of charge. Other presentations are scheduled in the Si2 Booth #1427 on the DAC exhibit floor at: June 4 - 10:30 AM and 4:30 PM, and June 5 -1:30 PM. More information on this and other Si2 events can be found at this link: http://www.si2.org/?page=1544.

About Si2

Si2 is the largest organization of industry-leading semiconductor, systems, EDA and manufacturing companies focused on the development and adoption of standards to improve the way integrated circuits are designed and manufactured. Now in its 25th year, Si2 is uniquely positioned to enable timely collaboration through dedicated staff and a strong implementation focus driven by its member companies. Si2 represents over 80 companies involved in all parts of the silicon supply chain throughout the world. See www.si2.org

About TechAmerica

TechAmerica is the leading voice for the U.S. technology industry – the driving force behind productivity growth and job creation in the United States and the foundation of the global innovation economy. Representing premier technology companies of all sizes, we are the industry’s only trade association dedicated to advocating for the ICT sector before decision makers at the state, federal and international levels of government. With offices in Washington, D.C., Silicon Valley, Brussels and Beijing, as well as regional offices around the U.S., we deliver our members top-tier business intelligence and networking opportunities on a global scale. We are committed to expanding market opportunities and driving the competitiveness of the U.S. technology industry around the world. Learn more about TechAmerica at www.techamerica.org.



Contact:

Silicon Integration Initiative
William Bayer, 512-342-2244, ext. 304




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