Tokyo, Japan – September 3, 2008 – TOOL Corporation (headquarters in Tokyo Japan, president Hideaki Hontao) announced the release of LAVIS Version 8.0, their layout visualization platform software. This version improved the usability of the functions added in LAVIS Ver.7.2, and added further enhancements to some of its existing functions. Also, LAVIS's robust integrations with other EDA vendor tools transcend its capability allowing it to be used throughout the design and manufacturing processes.
The main topics among the various enhancements in this version, most notably the improvements in usability, are introduced as follows:
- Reduced memory usage in file opening and improved drawing quality
For MEBES and VSB12, the memory usage in file opening is dramatically reduced to 1/10 for MEBES and 1/3 for VSB12 from the previous version. The drawing quality is also improved, and this allows finer drawing in omission display mode. This improvement answers to the challenge of handling ever increasing large sized data.
- Enhancements in the Node Trace function
The Node List function is added to the Node Trace function. It is an all-in-one management tool that allows users to handle the node trace results, including more flexible color setup for those traced nodes and wirings, show the information of figures, and call the tool to check the width and space between wirings of the results. Furthermore, the content in the Node List can be saved, so that node trace results can easily be reproduced.
- Enhancements in the GDS Simple Edit function (option)
With the GDS Simple Edit function, users can now rotate an object, split a figure, select multiple objects and edit them at a time. These functions help fixing the layout in short time and in various phases, especially in tight situation like before tape-out.
- Enhancement in the 3D View function (option)
3D View, one of the LAVIS optional functions that provide an effective solution in failure analyses, now allows users to have a complete set of display controls, including changing the color and transparency of each layer, enlarging/reducing the size of cross-section view that is associated with the displayed 3D view, and specifying the color of the insulator image. Moreover, the display status can be saved and reproduced, so that it is more convenient to redo the analysis.
In addition to the above mentioned functions, there are many improvements in present functions, including search functions, measurement function, and DensityMap display.
"This version update strengthened the LAVIS existing functions," said Hideaki Hontao, president of TOOL. "We are committed to keep delivering the answers to customers, and to continue to enhance both the functionality and performance for further quality improvements of LAVIS."
LAVIS is a versatile and ultra-high speed layout visualization platform that supports large data and multiple file formats. Its unique display method, coupled with memory management technology, efficiently enables large volume data handling and fast display. Most importantly, LAVIS can be used as a common standard layout platform for all the IC processes such as design, verification, mask data preparation, inspection and failure analysis, thanks to its capability to support various data formats, including GDSII, OASIS, LEF/DEF and e-beam thereby making it easy to interface with other tools for the entire IC making flow.
TOOL is a Japanese software development company focused primarily on EDA tool development. Its particular strength is in the area of layout design, and has scored a number of achievements in this area with its development tool, LAVIS and MaskStudio. Solutions to chipmakers' problems can be provided by combining TOOL’s package-software with its custom-tailored software developed to serve a customer’s particular need. TOOL provides ample experience in this particular area. For more information on TOOL and products, please refer to http://www.tool-corp.com/.
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