MoSys Participates at LSI’s Accelerating Innovation Summit 2011

SANTA CLARA, Calif. — (BUSINESS WIRE) — November 16, 2011 — MoSys, Inc.:

Who:

 

MoSys (NASDAQ: MOSY), a leading provider of serial chip-to-chip communications solutions that deliver unparalleled bandwidth performance for next generation networking systems and advanced system-on-chip (SoC) designs, is presenting at LSI’s Accelerating Innovation Summit 2011.

 

Michael Miller, VP of Technology Innovation & System Applications, is a panelist on Track 3, Session 3, “Core Technologies to Accelerate Innovation in Networking & Storage.” The panel will debate the pros and cons of memory solutions for specific networking applications. This session occurs 2 – 3:30 p.m. on both days of the conference.

 

What:

LSI’s Accelerating Innovation Summit 2011 is a two-day, invitation-only conference where LSI representatives and industry experts will share their technology insights. Demonstrations of LSI’s unique storage and networking silicon innovations will be shown.

 

When:

LSI’s Accelerating Innovation Summit 2011 takes place November 16-17, 2011.

 

Where:

Crowne Plaza San Jose – Silicon Valley
777 Bellew Drive
Milpitas, CA 95035

 

More information about MoSys’ participation at LSI’s Accelerating Innovation Summit 2011 and other upcoming conferences is available on its website at http://www.mosys.com/eventCalendar.php .

 

1 | 2  Next Page »



Review Article Be the first to review this article
Harris

Trimble Catalyst

Featured Video
Jobs
Geospatial Analyst for Vencore at Suitland, MD
Geospatial Intelligence Analyst for Quick Services LLC at Fort Bragg, NC
Sr. Mechanical Engineer for Kateeva at Newark, CA
Mgr Mechanical Engineering 2 for Northrop Grumman at Melbourne, FL
MECHANICAL ENGINEER for Peter R. Thom and Associates at ORINDA, CA
Upcoming Events
DGI 2017 at QEII Centre London United Kingdom - Jan 23 - 25, 2017
GMP Compliance for Quality Control Laboratories 2016 at Andheri Kurla Road, Sahar Village, Andheri-Kurla Road, Mumbai, Maharashtra 40005 Mumbai, Maharashtra India - Jan 23 - 24, 2017
Geospatial World Forum 2017 Hyderabad at Hyderabad International Convention Center P.O Bag 1101, Cyberabad Post Office Hyderabad Telangana India - Jan 23 - 25, 2017
Teledyne Optech
University of Denver GIS Masters Degree Online
Teledyne:
CADalog.com - Countless CAD add-ons, plug-ins and more.



Internet Business Systems © 2017 Internet Business Systems, Inc.
595 Millich Dr., Suite 216, Campbell, CA 95008
+1 (408)-337-6870 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering EDACafe - Electronic Design Automation TechJobsCafe - Technical Jobs and Resumes  MCADCafe - Mechanical Design and Engineering ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy Policy