One of the key breakthroughs associated with this announcement is the ability for SoC developers to seamlessly migrate their SystemC-based SonicsMX configurations into an RTL form ready for functional verification and logic synthesis. The SonicsMX SystemC and RTL models support a wide range of transaction level modeling design techniques, enabling SoC architects to rapidly explore architectural choices such as topologies, protocol choices, buffering, quality-of-service (QoS), security, power management, and pipelining. In contrast, traditional SystemC-based architectural approaches focus purely on algorithmic and contention-oriented performance analysis, leaving many key system and physical optimization issues for the RTL design phase, which uses different methodologies. The new version of SonicsStudio eliminates such risks when using SonicsMX.
"As SoC complexities continue to explode, and the interconnect continues to move towards the centerpiece of the design, it's essential that SoC architects analyze the performance and cost tradeoffs of the interconnect as early as possible in the development project," said Drew Wingard, chief technology officer, Sonics Inc. "Sonics has already enabled its customers to make this shift with earlier versions of SonicsStudio. The availability of SystemC models for SonicsMX expands the SoC architect's exploration capabilities into higher levels of abstraction, and by supporting seamless iterations between SystemC and RTL views of SonicsMX, this new version of SonicsStudio enables teams to also deploy ESL techniques incrementally. This has a far reaching impact on the adoption of SystemC modeling by SoC developers."
Sonics recently announced that SystemC versions of Sonics SMART Interconnects solutions such as SonicsMX, that are suitable for operation in the CoWare Inc.'s Platform Architect product, will be available directly from CoWare Inc.
Sonics, Inc.(R) is the premier supplier of SMART Interconnects(TM) solutions that deliver high SoC design predictability and increased design efficiency. Major semiconductor and systems companies including Broadcom, Texas Instruments, Toshiba, and Samsung have applied Sonics' SMART Interconnects solutions in leading products in the wireless communications, digital multimedia, automotive, and office products markets. Sonics is a privately-held company funded by Cadence Design Systems, Toshiba Corp., Samsung Ventures, and venture capital firms Investar Capital, Smart Technology Ventures, TL Ventures, Easton Hunt Capital, JAFCO Ventures, and H&Q Asia-Pacific. For more information, see www.sonicsinc.com.
Sonics and SMART Interconnects are registered trademarks of Sonics, Inc. All other trademarks are the property of their respective owners.
Fast Forward PR (for Sonics Inc.) Mary Jane Reiter, 408-725-1239 Email Contact