Aurora Networks Chooses Zarlink Circuit Emulation Technology to Help Meet Latest Industry Performance Requirements
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Aurora Networks Chooses Zarlink Circuit Emulation Technology to Help Meet Latest Industry Performance Requirements

OTTAWA, CANADA -- (MARKET WIRE) -- Dec 10, 2008 -- Zarlink Semiconductor (TSX: ZL) today announced that Aurora Networks, Inc., a global leader in advanced optical transport systems for broadband networks, is using its Circuit Emulation Services-over-Packet (CESoP) solution to help meet strict Metro Ethernet Forum 18 (MEF 18) certification requirements. MEF 18 certification is an emerging requirement by network operators as they deploy new equipment to carry revenue-generating traffic over converged packet networks.

Aurora Networks' recently released GT3410A T1/E1 Access Module incorporates Zarlink's ZL™50120 CESoP processor in the design and has received MEF 18 certification. Zarlink's CESoP solution provides critical TDM-over-packet and timing capabilities to enable Carrier Ethernet performance required for emerging applications, including wireless backhaul of TDM-based services over mobile broadband networks.

"MEF 18 certification is a critical benchmark for service providers as they seek solutions to seamlessly deliver TDM services over Metro Ethernet and Carrier Ethernet networks," said Luis Yu, senior product manager, Aurora Networks. "Our focus is to provide scalable, cost-effective solutions for cable providers as they develop this market. Zarlink's highly integrated CESoP solution has allowed us to efficiently design and deploy an MEF 18 certified access module targeting this growing market."

"The ZL50120 processor enables seamless delivery of delay-sensitive TDM traffic with low jitter and minimal packet delay and packet delay variation to meet MEF 18 synchronization requirements," said Bruce Ernhofer, product segment manager with Zarlink's Communication Products group. "Zarlink's ZL50120 processor is an easy-to-implement solution that simplifies design, with built-in timing performance to fully meet MEF 18 under packet delay, packet loss and network impairment conditions."

Zarlink is the world's leading supplier of CESoP silicon devices to equipment manufacturers worldwide. Zarlink's CESoP solutions have been deployed in microwave systems, Gigabit Passive Optical Network (GPON) and Ethernet Passive Optical Network (EPON) applications, and gateway products. For details on the ZL50120 CESoP processor see and visit

About Aurora Networks

Aurora Networks is a global leader in advanced optical transport systems for broadband networks. The company's innovative solutions optimize network performance and enable the deployment of advanced residential and commercial broadband services. With a reputation for cutting-edge technology and award-winning engineering, Aurora Networks is a thriving, privately held company based in Santa Clara, California. For more information, call +1.408.235.7000 or visit

About Zarlink Semiconductor

For over 30 years, Zarlink Semiconductor has delivered semiconductor solutions that drive the capabilities of voice, enterprise, broadband and wireless communications. The Company's success is built on its technology strengths including voice and data networks, optoelectronics and ultra low-power communications. For more information, visit

Shareholders and other individuals wishing to receive, free of charge, copies of the reports filed with the U.S. Securities and Exchange Commission and Regulatory Authorities, should visit the Company's web site at or contact Investor Relations.

Certain statements in this press release constitute forward-looking statements within the meaning of the Private Securities Litigation Reform Act of 1995. Such forward-looking statements involve known and unknown risks, uncertainties, and other factors which may cause the actual results, performance or achievements of the Company to be materially different from any future results, performance, or achievements expressed or implied by such forward-looking statements. Such risks, uncertainties and assumptions include, among others, the following: our dependence on the successful development and market introduction of new products; our ability to integrate any business, technologies, product lines or services that we have or will acquire; our dependence on revenue generation from our legacy products in order to fund development of our new products; current market conditions, including the lack of liquidity in the markets and anticipated economic slow down, may increase our operating costs or reduce our revenue; thereby negatively impacting our operating results; our ability to operate profitably and generate positive cash flows in the future; our dependence on our foundry suppliers and third-party subcontractors; order cancellations and deferrals by our customers; our substantial indebtedness could adversely affect our financial position; the cost and accounting implications of compliance with new accounting standards; and other factors referenced in our Annual Report on Form 20-F. Investors are encouraged to consider the risks detailed in this filing.

Zarlink Semiconductor Inc.
Ed Goffin
Media Relations/ Investor Relations

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