TSMC Adds New High Voltage Features to Advanced 0.13-micron Processes Aimed at High Resolution Display Drivers

Greener display driver ICs anticipated

HSIN-CHU, Taiwan, Nov. 4 /PRNewswire-FirstCall/ -- TSMC (NYSE: TSM) has enhanced its 0.13um process technology with immediate availability of a 1.5/6/32V technology, targeted at high resolution mobile handset display drivers.

The high-yield process features an Aluminum Copper (AlCu) backend metal scheme and is designed to meet energy reduction targets, while responding to the market's demand for smaller line width options, reducing die size in next- generation high-resolution display driver ICs.

The growing popularity of mobile TV and Internet browsing demands a new generation of portable displays that feature high resolution and excellent power performance. The new 1.5/6/32V technology cuts die size requirements for new high-resolution mobile handset display drivers, while providing the high drive voltages required at the smaller 0.13um geometry.

TSMC's new process is particularly compact and provides the smallest SRAM bit cell of any commercial foundry, at no compromise to speed and stand-by power. It also adds the necessary core voltage under-drive range, at 1.2V, to meet the most stringent green panel requirements. Furthermore, innovative new fuse implementations simplify display optimization and matching during production testing.

About TSMC

TSMC is the world's largest dedicated semiconductor foundry, providing the industry's leading process technology and the foundry's largest portfolio of process-proven libraries, IP, design tools and reference flows. The Company's total managed capacity in 2008 is to exceed nine million (8-inch equivalent) wafers, including capacity from two advanced 12-inch Gigafabs, four eight-inch fabs, one six-inch fab, as well as TSMC's wholly owned subsidiaries, WaferTech and TSMC (Shanghai), and its joint venture fab, SSMC. TSMC is the first foundry to provide 40nm production capabilities. Its corporate headquarters are in Hsinchu, Taiwan. For more information about TSMC please see http://www.tsmc.com.

Web site: http://www.tsmc.com/




Review Article Be the first to review this article

Harris

Featured Video
Jobs
Product Manager for CHA Consulting, Inc. at Boston, Massachusetts
Geospatial Analyst/Programmer for LANDIQ at Sacramento, California
GIS Data Analyst for CostQuest Associates, Inc. at Cincinnati, Ohio
Software Developer for CHA Consulting, Inc. at Norwell, Massachusetts
Mechanical Engineer for Allen & Shariff Corporation at Pittsburgh, Pennsylvania
Mid-Level Mechanical Engineer for Kiewit at lenexa, Kansas
Upcoming Events
Locate 2018 at Pier 27, The Embarcadero San Francisco CA - May 30 - 31, 2018
2nd WY UAV Symposium at UW Convention Center 2229 Grand Ave LARAMIE WY - May 30 - 31, 2018
GeoIntelligence Asia at NEW DELHI India - Jun 4 - 5, 2018
SPAR 3D & AEC Next Technology Expo + Conference at Anaheim Convention Center Anaheim CA - Jun 5 - 7, 2018
Teledyne Optech
Bentley: -YII 2018 Awards



Internet Business Systems © 2018 Internet Business Systems, Inc.
25 North 14th Steet, Suite 710, San Jose, CA 95112
+1 (408) 882-6554 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering EDACafe - Electronic Design Automation TechJobsCafe - Technical Jobs and Resumes  MCADCafe - Mechanical Design and Engineering ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy PolicyAdvertise